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    74AUP2G132

    Low-power dual 2-input NAND Schmitt trigger

    The 74AUP2G132 is a dual 2-input NAND gate with Schmitt-trigger inputs. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

    特性

    • Wide supply voltage range from 0.8 V to 3.6 V

    • CMOS low power dissipation

    • High noise immunity

    • Low static power consumption; ICC = 0.9 μA (maximum)

    • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

    • Overvoltage tolerant inputs to 3.6 V

    • Low noise overshoot and undershoot < 10 % of VCC

    • IOFF circuitry provides partial Power-down mode operation

    • Complies with JEDEC standards:

      • JESD8-12 (0.8 V to 1.3 V)

      • JESD8-11 (0.9 V to 1.65 V)

      • JESD8-7 (1.65 V to 1.95 V)

      • JESD8-5 (2.3 V to 2.7 V)

      • JESD8C (2.7 V to 3.6 V)

    • ESD protection:

      • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

      • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

    • Multiple package options

    • Specified from -40 °C to +85 °C and -40 °C to +125 °C

    目标应用

    • Wave and pulse shaper

    • Astable multivibrator

    • Monostable multivibrator

    参数类型

    Type numberProduct statusVCC(A) (V)VCC(B) (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
    74AUP2G132DCProductionn.a.n.a.CMOS± 1.910702ultra low-40~12520334.1113VSSOP8
    74AUP2G132GNProductionn.a.n.a.CMOS± 1.910702ultra low-40~12523810.6148XSON8
    74AUP2G132GSProductionn.a.n.a.CMOS± 1.910702ultra low-40~12527610.8146XSON8
    74AUP2G132GTProductionn.a.n.a.CMOS± 1.910702ultra low-40~1253276.1157XSON8
    74AUP2G132GXProductionn.a.n.a.CMOS± 1.910702ultra low-40~125---X2SON8

    封装

    型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
    74AUP2G132DC
    VSSOP8
    (SOT765-1)     		SOT765-1SOT765-1_125ActiveaE274AUP2G132DC,125
    ( 9352 807 32125 )
    74AUP2G132GN
    XSON8
    (SOT1116)     		SOT1116REFLOW_BG-BD-1
    		SOT1116_115ActiveaE74AUP2G132GN,115
    ( 9352 922 22115 )
    74AUP2G132GS
    XSON8
    (SOT1203)     		SOT1203REFLOW_BG-BD-1
    		SOT1203_115ActiveaE74AUP2G132GS,115
    ( 9352 923 77115 )
    74AUP2G132GT
    XSON8
    (SOT833-1)     		SOT833-1SOT833-1_115ActiveaE274AUP2G132GT,115
    ( 9352 807 33115 )
    74AUP2G132GX
    X2SON8
    (SOT1233-2)     		SOT1233-2SOT1233-2_115ActiveaE74AUP2G132GXX
    ( 9353 397 96115 )

    环境信息

    型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
    74AUP2G132DC74AUP2G132DC,12574AUP2G132DCAlways Pb-free
    74AUP2G132GN74AUP2G132GN,11574AUP2G132GNAlways Pb-free
    74AUP2G132GS74AUP2G132GS,11574AUP2G132GSAlways Pb-free
    74AUP2G132GT74AUP2G132GT,11574AUP2G132GTAlways Pb-free
    74AUP2G132GX74AUP2G132GXX74AUP2G132GXweek 25, 2019
    品质及可靠性免责声明

    文档 (14)

    文件名称标题类型日期
    74AUP2G132Low-power dual 2-input NAND Schmitt triggerData sheet2023-07-26
    Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
    Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
    Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
    SOT1233-2plastic thermal enhanced extremely thin small outline package; no leads;8 terminals; body 1.35 x 0.8 x 0.32 mmPackage information2022-04-21
    MAR_SOT1203MAR_SOT1203 TopmarkTop marking2013-06-03
    SOT1203plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm bodyPackage information2022-06-03
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT833MAR_SOT833 TopmarkTop marking2013-06-03
    SOT833-1plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm bodyPackage information2022-06-03
    SOT765-1plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm bodyPackage information2022-06-03
    MAR_SOT1116MAR_SOT1116 TopmarkTop marking2013-06-03
    SOT1116plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm bodyPackage information2022-06-02
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

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    样品

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