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74AUP1G17

Low-power Schmitt trigger

The 74AUP1G17 is a single buffer with Schmitt-trigger input. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • CMOS low power dissipation

  • High noise immunity

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 ° C to +85 ° C and -40 ° C to +125 ° C

参数类型

Type numberProduct statusVCC(A) (V)VCC(B) (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Rth(j-c) (K/W)Package name
74AUP1G17GMProductionn.a.n.a.CMOS± 1.97.8701ultra low-40~125311157XSON6
74AUP1G17GNProductionn.a.n.a.CMOS± 1.97.8701ultra low-40~125334207XSON6
74AUP1G17GSProductionn.a.n.a.CMOS± 1.97.8701ultra low-40~125321215XSON6
74AUP1G17GVProductionn.a.n.a.CMOS± 1.97.8701ultra low-40~125268167TSOP5
74AUP1G17GWProductionn.a.n.a.CMOS± 1.97.8701ultra low-40~125309179TSSOP5
74AUP1G17GXProductionn.a.n.a.CMOS± 1.97.8701ultra low-40~125322191X2SON5
74AUP1G17GX4Productionn.a.n.a.CMOS± 1.97.8701ultra low-40~125--X2SON4

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1G17GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActivepJ74AUP1G17GM,132
( 9352 790 25132 )
SOT886_115ActivepJ74AUP1G17GM,115
( 9352 790 25115 )
74AUP1G17GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActivepJ74AUP1G17GN,132
( 9352 917 29132 )
74AUP1G17GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActivepJ74AUP1G17GS,132
( 9352 928 54132 )
74AUP1G17GV
TSOP5
(SOT753) 		SOT753REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT753_125ActivepJ74AUP1G17GVH
( 9353 353 27125 )
74AUP1G17GW
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125ActivepJ74AUP1G17GW,125
( 9352 790 24125 )
74AUP1G17GX
X2SON5
(SOT1226-3) 		SOT1226-3SOT1226-3_125ActivepJ74AUP1G17GX,125
( 9352 982 28125 )
74AUP1G17GX4
X2SON4
(SOT1269-2) 		SOT1269-2SOT1269-2_147ActivepJ74AUP1G17GX4Z
( 9353 401 17147 )

停产信息

型号可订购的器件编号，（订购码(12NC)）最后一次购买日期最后一次交货日期替代产品状态备注
74AUP1G17GW935279024115

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP1G17GM74AUP1G17GM,13274AUP1G17GMAlways Pb-free
74AUP1G17GM74AUP1G17GM,11574AUP1G17GMAlways Pb-free
74AUP1G17GN74AUP1G17GN,13274AUP1G17GNAlways Pb-free
74AUP1G17GS74AUP1G17GS,13274AUP1G17GSAlways Pb-free
74AUP1G17GV74AUP1G17GVH74AUP1G17GVweek 25, 2019
74AUP1G17GW74AUP1G17GW,12574AUP1G17GWAlways Pb-free
74AUP1G17GX74AUP1G17GX,12574AUP1G17GXAlways Pb-free
74AUP1G17GX474AUP1G17GX4Z74AUP1G17GX4week 25, 2019
品质及可靠性免责声明

文档 (23)

文件名称标题类型日期
74AUP1G17Low-power Schmitt triggerData sheet2023-07-18
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup1g1774AUP1G17 IBIS modelIBIS model2018-05-25
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1226-3plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mmPackage information2020-08-27
SOT1269-2plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm bodyPackage information2020-08-18
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT753MAR_SOT753 TopmarkTop marking2013-06-03
SOT753plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm bodyPackage information2022-05-31
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08

支持

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模型

文件名称标题类型日期
aup1g1774AUP1G17 IBIS modelIBIS model2018-05-25

样品

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