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74LVC1GU04

Unbuffered inverter

The 74LVC1GU04 is a single unbuffered inverter. The input can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device in a mixed 3.3 V and 5 V environment.

特性

  • Overvoltage tolerant inputs to 5.5 V

  • Wide supply voltage range from 1.65 V to 5.5 V

  • High noise immunity

  • ±24 mA output drive (VCC = 3.0 V)

  • CMOS low power dissipation

  • Latch-up performance exceeds 250 mA

  • Complies with JEDEC standard no. 8-1A

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Rth(j-c) (K/W)Package name
74LVC1GU04GMProduction1.65 - 5.5CMOS/LVTTL± 321751low-40~125320163XSON6
74LVC1GU04GNProduction1.65 - 5.5CMOS/LVTTL± 321751low-40~125358222XSON6
74LVC1GU04GSProduction1.65 - 5.5CMOS/LVTTL± 321751low-40~125341231XSON6
74LVC1GU04GVProduction1.65 - 5.5CMOS/LVTTL± 321751low-40~125278175TSOP5
74LVC1GU04GWProduction1.65 - 5.5CMOS/LVTTL± 321751low-40~125319188TSSOP5
74LVC1GU04GXProduction1.65 - 5.5CMOS/LVTTL± 321751low-40~125345211X2SON5

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74LVC1GU04GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActiveVD74LVC1GU04GM,132
( 9352 771 85132 )
SOT886_115ActiveVD74LVC1GU04GM,115
( 9352 771 85115 )
74LVC1GU04GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveVD74LVC1GU04GN,132
( 9352 917 95132 )
74LVC1GU04GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveVD74LVC1GU04GS,132
( 9352 929 23132 )
74LVC1GU04GV
TSOP5
(SOT753) 		SOT753REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT753_125ActiveVU474LVC1GU04GV,125
( 9352 720 22125 )
74LVC1GU04GW
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125ActiveVD74LVC1GU04GW,125
( 9352 685 96125 )
74LVC1GU04GX
X2SON5
(SOT1226-3) 		SOT1226-3SOT1226-3_125ActiveVD74LVC1GU04GX,125
( 9352 983 88125 )

停产信息

型号可订购的器件编号，（订购码(12NC)）最后一次购买日期最后一次交货日期替代产品状态备注
74LVC1GU04GW935268596165
74LVC1GU04GW935268596115
74LVC1GU04GW935268596118

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74LVC1GU04GM74LVC1GU04GM,13274LVC1GU04GMAlways Pb-free
74LVC1GU04GM74LVC1GU04GM,11574LVC1GU04GMAlways Pb-free
74LVC1GU04GN74LVC1GU04GN,13274LVC1GU04GNAlways Pb-free
74LVC1GU04GS74LVC1GU04GS,13274LVC1GU04GSAlways Pb-free
74LVC1GU04GV74LVC1GU04GV,12574LVC1GU04GVweek 36, 2003
74LVC1GU04GW74LVC1GU04GW,12574LVC1GU04GWweek 36, 2003
74LVC1GU04GX74LVC1GU04GX,12574LVC1GU04GXAlways Pb-free
品质及可靠性免责声明

文档 (22)

文件名称标题类型日期
74LVC1GU04Unbuffered inverterData sheet2023-09-07
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11009Pin FMEA for LVC familyApplication note2019-01-09
lvc1gu0474LVC1GU04 IBIS modelIBIS model2014-10-20
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1226-3plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mmPackage information2020-08-27
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT753MAR_SOT753 TopmarkTop marking2013-06-03
SOT753plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm bodyPackage information2022-05-31
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08

支持

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模型

文件名称标题类型日期
lvc1gu0474LVC1GU04 IBIS modelIBIS model2014-10-20

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品： https://extranet.nexperia.com.

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