特性
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Wide supply voltage range from 1.0 V to 5.5 V
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CMOS low power dissipation
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Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
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Optimized for low voltage applications: 1.0 V to 3.6 V
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Accepts TTL input levels between VCC = 2.7 V and VCC = 3.6 V
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Typical output ground bounce < 0.8 V at VCC = 3.3 V and Tamb = 25 °C
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Typical HIGH-level output voltage (VOH) undershoot: > 2 V at VCC = 3.3 V and Tamb = 25 °C
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Complies with JEDEC standards:
- JESD8-7 (1.65 V to 1.95 V)
- JESD8-5 (2.3 V to 2.7 V)
- JESD8C (2.7 V to 3.6 V)
- JESD36 (4.5 V to 5.5 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|
74LV04BQ | Production | 1.0 - 5.5 | CMOS | ± 12 | 30 | 6 | low | -40~125 | 89 | 55 | DHVQFN14 |
74LV04D | Production | 1.0 - 5.5 | CMOS | ± 12 | 30 | 6 | low | -40~125 | 86 | 44 | SO14 |
74LV04PW | Production | 1.0 - 5.5 | CMOS | ± 12 | 30 | 6 | low | -40~125 | 125 | 50.1 | TSSOP14 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74LV04BQ | DHVQFN14 (SOT762-1) | SOT762-1 | SOT762-1_115 | Active | LV04 | 74LV04BQ,115 ( 9352 855 66115 ) | |
74LV04D | SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_118 | Active | 74LV04D | 74LV04D,118 ( 9350 631 30118 ) |
74LV04PW | TSSOP14 (SOT402-1) | SOT402-1 | SSOP-TSSOP-VSO-WAVE | SOT402-1_118 | Active | LV04 | 74LV04PW,118 ( 9351 742 10118 ) |
下表中的版本已停产。参见表 停产信息 了解更多信息。
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74LV04D | SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_112 | Withdrawn / End-of-life | 74LV04D | 74LV04D,112 ( 9350 631 30112 ) |
文档 (11)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LV04 | Hex inverter | Data sheet | 2024-04-17 |
lv04 | 74LV04 IBIS model | IBIS model | 2019-01-09 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
lv | lv Spice model | SPICE model | 2013-05-06 |
SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
支持
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样品
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