特性
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Wide supply voltage range from 2.0 V to 6.0 V
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Symmetrical output impedance
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High noise immunity
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CMOS low power dissipation
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Unimited input rise and fall times
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Balanced propagation delays
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Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
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Input levels:
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For 74HC1G14: CMOS level
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For 74HCT1G14: TTL level
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Complies with JEDEC standards:
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JESD8C (2.7 V to 3.6 V)
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JESD7A (2.0 V to 6.0 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Specified from -40 °C to +85° C and -40° C to +125 °C
目标应用
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Wave and pulse shapers
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Astable multivibrators
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Monostable multivibrators
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|
74HC1G14GV | Production | 2.0 - 6.0 | CMOS | ± 2.6 | 36 | 1 | low | -40~125 | 227 | 136 | TSOP5 |
74HC1G14GW | Production | 2.0 - 6.0 | CMOS | ± 2.6 | 36 | 1 | low | -40~125 | 268 | 144 | TSSOP5 |
74HCT1G14GV | Production | 4.5 - 5.5 | TTL | ± 2 | 36 | 1 | low | -40~125 | 227 | 136 | TSOP5 |
74HCT1G14GW | Production | 4.5 - 5.5 | TTL | ± 2 | 36 | 1 | low | -40~125 | 268 | 144 | TSSOP5 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74HC1G14GV | TSOP5 (SOT753) | SOT753 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT753_125 | Active | H14 | 74HC1G14GV,125 ( 9352 718 83125 ) |
74HC1G14GW | TSSOP5 (SOT353-1) | SOT353-1 | WAVE_BG-BD-1 | SOT353-1_125 | Active | HF | 74HC1G14GW,125 ( 9352 457 30125 ) |
74HCT1G14GV | TSOP5 (SOT753) | SOT753 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT753_125 | Active | T14 | 74HCT1G14GV,125 ( 9352 718 82125 ) |
74HCT1G14GW | TSSOP5 (SOT353-1) | SOT353-1 | WAVE_BG-BD-1 | SOT353-1_125 | Active | TF | 74HCT1G14GW,125 ( 9352 457 20125 ) |
停产信息
型号 | 可订购的器件编号,(订购码(12NC)) | 最后一次购买日期 | 最后一次交货日期 | 替代产品 | 状态 | 备注 |
---|---|---|---|---|---|---|
74HC1G14GW | 935245730165 | |||||
74HC1G14GW | 935245730115 | |||||
74HC1G14GW | 935245730118 | |||||
74HCT1G14GW | 935245720165 | |||||
74HCT1G14GW | 935245720115 | |||||
74HCT1G14GW | 935245720118 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74HC1G14GV | 74HC1G14GV,125 | 74HC1G14GV | week 36, 2003 | ||
74HC1G14GW | 74HC1G14GW,125 | 74HC1G14GW | week 36, 2003 | ||
74HCT1G14GV | 74HCT1G14GV,125 | 74HCT1G14GV | week 36, 2003 | ||
74HCT1G14GW | 74HCT1G14GW,125 | 74HCT1G14GW | week 36, 2003 |
文档 (7)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
hc1g14 | IBIS model of 74HC1G14 | IBIS model | 2021-05-06 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
样品
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