参数类型
| Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AUP2G0604GM | Production | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 2 | ultra low | -40~125 | 290 | 6.5 | 145 | XSON6 |
| 74AUP2G0604GN | Production | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 2 | ultra low | -40~125 | 275 | 11.7 | 171 | XSON6 |
| 74AUP2G0604GS | Production | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 2 | ultra low | -40~125 | 272 | 14.8 | 177 | XSON6 |
| 74AUP2G0604GW | Production | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 2 | ultra low | -40~125 | 264 | 38.6 | 153 | TSSOP6 |
封装
| 型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号，（订购码(12NC)） |
|---|---|---|---|---|---|---|---|
| 74AUP2G0604GM |  XSON6 (SOT886) | SOT886 | REFLOW_BG-BD-1 | SOT886_125 | Active | a6 | 74AUP2G0604GMH ( 9352 996 53125 ) |
| 74AUP2G0604GN |  XSON6 (SOT1115) | SOT1115 | REFLOW_BG-BD-1 | SOT1115_125 | Active | a6 | 74AUP2G0604GNH ( 9352 996 54125 ) |
| 74AUP2G0604GS |  XSON6 (SOT1202) | SOT1202 | REFLOW_BG-BD-1 | SOT1202_125 | Active | a6 | 74AUP2G0604GSH ( 9352 996 55125 ) |
| 74AUP2G0604GW |  TSSOP6 (SOT363-2) | SOT363-2 | SOT363-2_125 | Active | a6 | 74AUP2G0604GWH ( 9352 996 56125 ) |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
|---|---|---|---|---|---|
| 74AUP2G0604GM | 74AUP2G0604GMH | 74AUP2G0604GM |  |   | Always Pb-free |
| 74AUP2G0604GN | 74AUP2G0604GNH | 74AUP2G0604GN | | | Always Pb-free |
| 74AUP2G0604GS | 74AUP2G0604GSH | 74AUP2G0604GS | | | Always Pb-free |
| 74AUP2G0604GW | 74AUP2G0604GWH | 74AUP2G0604GW | | | Always Pb-free |
文档 (10)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
| SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
| SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
支持
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样品
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