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    74AUP1GU04

    Low-power unbuffered inverter

    The 74AUP1GU04 is a single unbuffered inverter. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

    特性

    • Wide supply voltage range from 0.8 V to 3.6 V

    • High noise immunity

    • CMOS low power dissipation

    • Low static power consumption; ICC = 0.9 μA (maximum)

    • Low noise overshoot and undershoot < 10% of VCC

    • IOFF circuitry provides partial Power-down mode operation

    • Latch-up performance exceeds 100 mA per JESD 78 Class II

    • Overvoltage tolerant inputs to 3.6 V

    • Complies with JEDEC standards:

      • JESD8-12 (0.8 V to 1.3 V)

      • JESD8-11 (0.9 V to 1.65 V)

      • JESD8-7 (1.65 V to 1.95 V)

      • JESD8-5 (2.3 V to 2.7 V)

      • JESD8C (2.7 V to 3.6 V)

    • ESD protection:

      • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

      • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

    • Multiple package options

    • Specified from -40 °C to +85 °C and -40 °C to +125 °C

    参数类型

    Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Rth(j-c) (K/W)Package name
    74AUP1GU04GMProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125311157XSON6
    74AUP1GU04GNProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125334207XSON6
    74AUP1GU04GSProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125321215XSON6
    74AUP1GU04GWProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125309179TSSOP5
    74AUP1GU04GXProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125322191X2SON5

    封装

    型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
    74AUP1GU04GM
    XSON6
    (SOT886)     		SOT886REFLOW_BG-BD-1
    		SOT886_132ActivepD74AUP1GU04GM,132
    ( 9352 790 66132 )
    SOT886_115ActivepD74AUP1GU04GM,115
    ( 9352 790 66115 )
    74AUP1GU04GN
    XSON6
    (SOT1115)     		SOT1115REFLOW_BG-BD-1
    		SOT1115_132ActivepD74AUP1GU04GN,132
    ( 9352 917 51132 )
    74AUP1GU04GS
    XSON6
    (SOT1202)     		SOT1202REFLOW_BG-BD-1
    		SOT1202_132ActivepD74AUP1GU04GS,132
    ( 9352 928 75132 )
    74AUP1GU04GW
    TSSOP5
    (SOT353-1)     		SOT353-1WAVE_BG-BD-1
    		SOT353-1_125ActivepD74AUP1GU04GW,125
    ( 9352 790 65125 )
    74AUP1GU04GX
    X2SON5
    (SOT1226-3)     		SOT1226-3SOT1226-3_125ActivepD74AUP1GU04GX,125
    ( 9352 983 73125 )

    环境信息

    型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
    74AUP1GU04GM74AUP1GU04GM,13274AUP1GU04GMAlways Pb-free
    74AUP1GU04GM74AUP1GU04GM,11574AUP1GU04GMAlways Pb-free
    74AUP1GU04GN74AUP1GU04GN,13274AUP1GU04GNAlways Pb-free
    74AUP1GU04GS74AUP1GU04GS,13274AUP1GU04GSAlways Pb-free
    74AUP1GU04GW74AUP1GU04GW,12574AUP1GU04GWAlways Pb-free
    74AUP1GU04GX74AUP1GU04GX,12574AUP1GU04GXAlways Pb-free
    品质及可靠性免责声明

    文档 (19)

    文件名称标题类型日期
    74AUP1GU04Low-power unbuffered inverterData sheet2023-07-28
    AN10161PicoGate Logic footprintsApplication note2002-10-29
    AN11052Pin FMEA for AUP familyApplication note2019-01-09
    aup1gu0474AUP1GU04 IBIS modelIBIS model2014-12-14
    Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
    Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
    Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
    SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
    WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
    SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
    SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
    MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
    SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    SOT1226-3plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mmPackage information2020-08-27

    支持

    如果您需要设计/技术支持，请告知我们并填写 应答表, 我们会尽快回复您。

    模型

    文件名称标题类型日期
    aup1gu0474AUP1GU04 IBIS modelIBIS model2014-12-14

    样品

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    样品订单通常需要2-4天寄送时间。

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