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74AUP1G240

Low-power inverting buffer/line driver; 3-state

The 74AUP1G240 is a 1-bit inverting buffer/line driver with 3-state outputs. The device features an output enable (OE). A HIGH on OE causes the output to assume a high-impedance OFF-state. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • High noise immunity

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • Input-disable feature allows floating input conditions

  • IOFF circuitry provides partial Power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Rth(j-c) (K/W)Package name
74AUP1G240GMProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125311157XSON6
74AUP1G240GNProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125334207XSON6
74AUP1G240GSProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125321215XSON6
74AUP1G240GWProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125309179TSSOP5
74AUP1G240GXProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125322191X2SON5

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1G240GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132Activep274AUP1G240GM,132
( 9352 790 62132 )
SOT886_115Activep274AUP1G240GM,115
( 9352 790 62115 )
74AUP1G240GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132Activep274AUP1G240GN,132
( 9352 917 33132 )
74AUP1G240GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132Activep274AUP1G240GS,132
( 9352 928 57132 )
74AUP1G240GW
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125Activep274AUP1G240GW,125
( 9352 790 61125 )
74AUP1G240GX
X2SON5
(SOT1226-3) 		SOT1226-3SOT1226-3_125Activep274AUP1G240GX,125
( 9352 983 72125 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP1G240GM74AUP1G240GM,13274AUP1G240GMAlways Pb-free
74AUP1G240GM74AUP1G240GM,11574AUP1G240GMAlways Pb-free
74AUP1G240GN74AUP1G240GN,13274AUP1G240GNAlways Pb-free
74AUP1G240GS74AUP1G240GS,13274AUP1G240GSAlways Pb-free
74AUP1G240GW74AUP1G240GW,12574AUP1G240GWAlways Pb-free
74AUP1G240GX74AUP1G240GX,12574AUP1G240GXAlways Pb-free
品质及可靠性免责声明

文档 (19)

文件名称标题类型日期
74AUP1G240Low-power inverting buffer/line driver; 3-stateData sheet2023-07-18
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup1g24074AUP1G240 IBIS modelIBIS model2014-12-14
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1226-3plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mmPackage information2020-08-27

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模型

文件名称标题类型日期
aup1g24074AUP1G240 IBIS modelIBIS model2014-12-14

样品

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