特性
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Wide supply voltage range from 0.8 V to 3.6 V
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High noise immunity
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CMOS low power dissipation
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Low static power consumption; ICC = 0.9 μA (maximum)
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Latch-up performance exceeds 100 mA per JESD 78 Class II
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Overvoltage tolerant inputs to 3.6 V
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Low noise overshoot and undershoot < 10 % of VCC
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IOFF circuitry provides partial Power-down mode operation
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Complies with JEDEC standards:
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JESD8-12 (0.8 V to 1.3 V)
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JESD8-11 (0.9 V to 1.65 V)
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JESD8-7 (1.65 V to 1.95 V)
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JESD8-5 (2.3 V to 2.7 V)
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JESD8C (2.7 V to 3.6 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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Specified from −40 °C to +85 °C and −40 °C to +125 °C
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|
74AUP1G06GM | Production | 0.8 - 3.6 | CMOS | 1.9 | 70 | 1 | ultra low | -40~125 | 311 | 157 | XSON6 |
74AUP1G06GN | Production | 0.8 - 3.6 | CMOS | 1.9 | 70 | 1 | ultra low | -40~125 | 334 | 207 | XSON6 |
74AUP1G06GS | Production | 0.8 - 3.6 | CMOS | 1.9 | 70 | 1 | ultra low | -40~125 | 321 | 215 | XSON6 |
74AUP1G06GW | Production | 0.8 - 3.6 | CMOS | 1.9 | 70 | 1 | ultra low | -40~125 | 309 | 179 | TSSOP5 |
74AUP1G06GX | Production | 0.8 - 3.6 | CMOS | 1.9 | 70 | 1 | ultra low | -40~125 | 322 | 191 | X2SON5 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74AUP1G06GM | XSON6 (SOT886) | SOT886 | REFLOW_BG-BD-1 | SOT886_132 | Active | pR | 74AUP1G06GM,132 ( 9352 790 16132 ) |
SOT886_115 | Active | pR | 74AUP1G06GM,115 ( 9352 790 16115 ) | ||||
74AUP1G06GN | XSON6 (SOT1115) | SOT1115 | REFLOW_BG-BD-1 | SOT1115_132 | Active | pR | 74AUP1G06GN,132 ( 9352 917 15132 ) |
74AUP1G06GS | XSON6 (SOT1202) | SOT1202 | REFLOW_BG-BD-1 | SOT1202_132 | Active | pR | 74AUP1G06GS,132 ( 9352 928 28132 ) |
74AUP1G06GW | TSSOP5 (SOT353-1) | SOT353-1 | WAVE_BG-BD-1 | SOT353-1_125 | Active | pR | 74AUP1G06GW,125 ( 9352 790 04125 ) |
74AUP1G06GX | X2SON5 (SOT1226-3) | SOT1226-3 | SOT1226-3_125 | Active | pR | 74AUP1G06GX,125 ( 9352 983 56125 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74AUP1G06GM | 74AUP1G06GM,132 | 74AUP1G06GM | Always Pb-free | ||
74AUP1G06GM | 74AUP1G06GM,115 | 74AUP1G06GM | Always Pb-free | ||
74AUP1G06GN | 74AUP1G06GN,132 | 74AUP1G06GN | Always Pb-free | ||
74AUP1G06GS | 74AUP1G06GS,132 | 74AUP1G06GS | Always Pb-free | ||
74AUP1G06GW | 74AUP1G06GW,125 | 74AUP1G06GW | Always Pb-free | ||
74AUP1G06GX | 74AUP1G06GX,125 | 74AUP1G06GX | Always Pb-free |
文档 (19)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AUP1G06 | Low-power inverter with open-drain output | Data sheet | 2023-07-11 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11052 | Pin FMEA for AUP family | Application note | 2019-01-09 |
aup1g06 | 74AUP1G06 IBIS model | IBIS model | 2014-12-14 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
SOT1226-3 | plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
样品
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