特性
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Wide supply voltage range from 1.0 to 5.5 V
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CMOS low power dissipation
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Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
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Optimized for low voltage applications: 1.0 V to 3.6 V
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Accepts TTL input levels between VCC = 2.7 V and VCC = 3.6 V
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Typical VOLP (output ground bounce) < 0.8 V at VCC = 3.3 V; Tamb = 25 °C
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Typical VOHV (output VOH undershoot) > 2 V at VCC = 3.3 V; Tamb = 25 °C
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Complies with JEDEC standards:
- JESD8-7 (1.65 V to 1.95 V)
- JESD8-5 (2.3 V to 2.7 V)
- JESD8C (2.7 V to 3.6 V)
- JESD36 (4.5 V to 5.5 V)
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ESD protection:
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HBM JESD22-A114F exceeds 2 kV
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MM JESD22-A115-A exceeds 200 V
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|
74LV244D | Production | 1.0 - 5.5 | CMOS | ± 16 | 30 | 8 | low | -40~125 | 76 | 52 | SO20 |
74LV244PW | Production | 1.0 - 5.5 | CMOS | ± 16 | 30 | 8 | low | -40~125 | 94 | 38.3 | TSSOP20 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74LV244D | SO20 (SOT163-1) | SOT163-1 | WAVE_BG-BD-1 | SOT163-1_118 | Active | 74LV244D | 74LV244D,118 ( 9350 563 70118 ) |
74LV244PW | TSSOP20 (SOT360-1) | SOT360-1 | SSOP-TSSOP-VSO-WAVE | SOT360-1_118 | Active | LV244 | 74LV244PW,118 ( 9351 746 50118 ) |
下表中的版本已停产。参见表 停产信息 了解更多信息。
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74LV244D | SO20 (SOT163-1) | SOT163-1 | WAVE_BG-BD-1 | SOT163-1_112 | Withdrawn / End-of-life | 74LV244D | 74LV244D,112 ( 9350 563 70112 ) |
74LV244PW | TSSOP20 (SOT360-1) | SOT360-1 | SSOP-TSSOP-VSO-WAVE | SOT360-1_112 | Withdrawn / End-of-life | LV244 | 74LV244PW,112 ( 9351 746 50112 ) |
文档 (9)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LV244 | Octal buffer/line driver; 3-state | Data sheet | 2021-09-24 |
AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
lv244 | 74LV244 IBIS model | IBIS model | 2019-01-09 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
lv | lv Spice model | SPICE model | 2013-05-06 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-21 |
SOT163-1 | plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body | Package information | 2022-06-20 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
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