特性
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Single supply voltage translator at 1.8 V, 2.5 V, 3.3 V and 5.0 V
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Up translation
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1.2 V to 1.8 V at VCC = 1.8 V
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1.5 V to 2.5 V at VCC = 2.5 V
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1.8 V to 3.3 V at VCC = 3.3 V
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3.3 V to 5.0 V at VCC = 5.0 V
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Down translation
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3.3 V to 1.8 V at VCC = 1.8 V
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3.3 V to 2.5 V at VCC = 2.5 V
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5.0 V to 3.3 V at VCC = 3.3 V
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5 V tolerant inputs
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Latch-up performance exceeds 250 mA per JESD 78 Class II
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
目标应用
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Portable applications
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PC and notebooks
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Industrial controller
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Telecom
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|
74LV1T34GV | Production | 1.6 - 5.5 | CMOS | ± 8 | 1 | low | -40~125 | 276 | 66.9 | 173 | TSOP5 |
74LV1T34GW | Production | 1.6 - 5.5 | CMOS | ± 8 | 1 | low | -40~125 | 316 | 85.8 | 186 | TSSOP5 |
74LV1T34GX | Production | 1.6 - 5.5 | CMOS | ± 8 | 1 | low | -40~125 | 340 | 105.0 | 206 | X2SON5 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74LV1T34GV | TSOP5 (SOT753) | SOT753 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT753_125 | Active | SQ | 74LV1T34GVH ( 9356 909 47125 ) |
74LV1T34GW | TSSOP5 (SOT353-1) | SOT353-1 | WAVE_BG-BD-1 | SOT353-1_125 | Active | SQ | 74LV1T34GWH ( 9356 902 03125 ) |
74LV1T34GX | X2SON5 (SOT1226-3) | SOT1226-3 | SOT1226-3_125 | Active | SQ | 74LV1T34GXH ( 9356 902 04125 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74LV1T34GV | 74LV1T34GVH | 74LV1T34GV | |||
74LV1T34GW | 74LV1T34GWH | 74LV1T34GW | week 25, 2019 | ||
74LV1T34GX | 74LV1T34GXH | 74LV1T34GX | week 25, 2019 |
文档 (11)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LV1T34 | Single supply translating buffer | Data sheet | 2023-12-06 |
lv1t34 | IBIS model of 74LV1T34 | IBIS model | 2018-01-19 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
SOT1226-3 | plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
订购、定价与供货
样品
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