• NG体育娱乐，ng体育平台

    ×

    74AUP3G07

    Low-power triple buffer with open-drain output

    The 74AUP3G07 is a triple non-inverting buffer with open-drain output. The output of the device is an open drain and can be connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions.

    Schmitt-trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.

    This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

    This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

    特性

    • Wide supply voltage range from 0.8 V to 3.6 V

    • High noise immunity

    • Complies with JEDEC standards:

      • JESD8-12 (0.8 V to 1.3 V)

      • JESD8-11 (0.9 V to 1.65 V)

      • JESD8-7 (1.2 V to 1.95 V)

      • JESD8-5 (1.8 V to 2.7 V)

      • JESD8-B (2.7 V to 3.6 V)

    • Low static power consumption; ICC = 0.9 μA (maximum)

    • Latch-up performance exceeds 100 mA per JESD 78B Class II

    • Inputs accept voltages up to 3.6 V

    • Low noise overshoot and undershoot < 10 % of VCC

    • IOFF circuitry provides partial Power-down mode operation

    • ESD protection:

      • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

      • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

    • Multiple package options

    • Specified from -40 °C to +85 °C and -40 °C to +125 °C

    参数类型

    Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Rth(j-c) (K/W)Package name
    74AUP3G07DCProduction0.8 - 3.6CMOS± 1.9703ultra low-40~125203113VSSOP8
    74AUP3G07GNProduction0.8 - 3.6CMOS± 1.9703ultra low-40~125238148XSON8
    74AUP3G07GSProduction0.8 - 3.6CMOS± 1.9703ultra low-40~125276146XSON8
    74AUP3G07GTProduction0.8 - 3.6CMOS± 1.9703ultra low-40~125327157XSON8

    封装

    型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
    74AUP3G07DC
    VSSOP8
    (SOT765-1)     		SOT765-1SOT765-1_125Activep0774AUP3G07DCH
    ( 9352 806 98125 )
    74AUP3G07GN
    XSON8
    (SOT1116)     		SOT1116REFLOW_BG-BD-1
    		SOT1116_115Activep774AUP3G07GNX
    ( 9353 058 02115 )
    74AUP3G07GS
    XSON8
    (SOT1203)     		SOT1203REFLOW_BG-BD-1
    		SOT1203_115Activep774AUP3G07GSX
    ( 9353 058 06115 )
    74AUP3G07GT
    XSON8
    (SOT833-1)     		SOT833-1SOT833-1_115Activep0774AUP3G07GTX
    ( 9352 806 99115 )

    环境信息

    型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
    74AUP3G07DC74AUP3G07DCH74AUP3G07DCAlways Pb-free
    74AUP3G07GN74AUP3G07GNX74AUP3G07GNAlways Pb-free
    74AUP3G07GS74AUP3G07GSX74AUP3G07GSAlways Pb-free
    74AUP3G07GT74AUP3G07GTX74AUP3G07GTAlways Pb-free
    品质及可靠性免责声明

    文档 (13)

    文件名称标题类型日期
    74AUP3G07Low-power triple buffer with open-drain outputData sheet2023-07-31
    aup3g0774AUP3G07 IBIS modelIBIS model2015-06-03
    Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
    Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
    MAR_SOT1203MAR_SOT1203 TopmarkTop marking2013-06-03
    SOT1203plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm bodyPackage information2022-06-03
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT833MAR_SOT833 TopmarkTop marking2013-06-03
    SOT833-1plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm bodyPackage information2022-06-03
    SOT765-1plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm bodyPackage information2022-06-03
    MAR_SOT1116MAR_SOT1116 TopmarkTop marking2013-06-03
    SOT1116plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm bodyPackage information2022-06-02
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

    支持

    如果您需要设计/技术支持，请告知我们并填写 应答表, 我们会尽快回复您。

    模型

    文件名称标题类型日期
    aup3g0774AUP3G07 IBIS modelIBIS model2015-06-03

    样品

    安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品： https://extranet.nexperia.com.

    样品订单通常需要2-4天寄送时间。

    如果您尚未取得安世半导体的直接采购帐号，我们的全球与区域经销网络可以协助您取得样品

    NG体育娱乐，ng体育平台