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74AUP2G16

Low-power dual buffer

The 74AUP2G16 provides two low-power, low-voltage buffers.

Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.

This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • High noise immunity

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Inputs accept voltages up to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Rth(j-c) (K/W)Package name
74AUP2G16GMProduction0.8 - 3.6CMOS± 1.9702ultra low-40~125290145XSON6
74AUP2G16GWProduction0.8 - 3.6CMOS± 1.9702ultra low-40~125264153TSSOP6

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP2G16GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_125Active5A74AUP2G16GMH
( 9353 075 48125 )
74AUP2G16GW
TSSOP6
(SOT363-2) 		SOT363-2SOT363-2_125Active5A74AUP2G16GWH
( 9353 075 47125 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP2G16GM74AUP2G16GMH74AUP2G16GMAlways Pb-free
74AUP2G16GW74AUP2G16GWH74AUP2G16GWAlways Pb-free
品质及可靠性免责声明

文档 (8)

文件名称标题类型日期
74AUP2G16Low-power dual bufferData sheet2023-07-26
aup2g1674AUP2G16 IBIS modelIBIS model2015-10-29
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

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模型

文件名称标题类型日期
aup2g1674AUP2G16 IBIS modelIBIS model2015-10-29

订购、定价与供货

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品： https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

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