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74AUP1G126

Low-power buffer/line driver; 3-state

The 74AUP1G126 provides a single non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the output enable input (OE). A LOW level at pin OE causes the output to assume a high-impedance OFF-state. This device has the input-disable feature, which allows floating input signals. The inputs are disabled when the output enable input OE is LOW.

Schmitt-trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V. This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing a damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • High noise immunity

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Inputs accept voltages up to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • Input-disable feature allows floating input conditions

  • IOFF circuitry provides partial power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Rth(j-c) (K/W)Package name
74AUP1G126GMProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125311157XSON6
74AUP1G126GNProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125334207XSON6
74AUP1G126GSProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125321215XSON6
74AUP1G126GWProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125309179TSSOP5
74AUP1G126GXProduction0.8 - 3.6CMOS± 1.9701ultra low-40~125322191X2SON5

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1G126GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActivepN74AUP1G126GM,132
( 9352 790 57132 )
SOT886_115ActivepN74AUP1G126GM,115
( 9352 790 57115 )
74AUP1G126GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActivepN74AUP1G126GN,132
( 9352 917 23132 )
74AUP1G126GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActivepN74AUP1G126GS,132
( 9352 928 47132 )
74AUP1G126GW
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125ActivepN74AUP1G126GW,125
( 9352 790 56125 )
74AUP1G126GX
X2SON5
(SOT1226) 		SOT1226REFLOW_BG-BD-1
SOT1226_125ActivepN74AUP1G126GX,125
( 9352 983 69125 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP1G126GM74AUP1G126GM,13274AUP1G126GMAlways Pb-free
74AUP1G126GM74AUP1G126GM,11574AUP1G126GMAlways Pb-free
74AUP1G126GN74AUP1G126GN,13274AUP1G126GNAlways Pb-free
74AUP1G126GS74AUP1G126GS,13274AUP1G126GSAlways Pb-free
74AUP1G126GW74AUP1G126GW,12574AUP1G126GWAlways Pb-free
74AUP1G126GX74AUP1G126GX,12574AUP1G126GXAlways Pb-free
品质及可靠性免责声明

文档 (21)

文件名称标题类型日期
74AUP1G126Low-power buffer/line driver; 3-stateData sheet2023-07-14
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup1g12674AUP1G126 IBIS modelIBIS model2014-12-14
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT1226MAR_SOT1226 TopmarkTop marking2013-06-03
SOT1226plastic, leadless thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm bodyPackage information2022-05-30
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

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模型

文件名称标题类型日期
aup1g12674AUP1G126 IBIS modelIBIS model2014-12-14

样品

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