特性
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Automotive product qualification in accordance with AEC-Q100 (Grade 1)
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
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Overvoltage tolerant inputs to 5.5 V
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Wide supply voltage range from 1.2 V to 3.6 V
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CMOS low-power consumption
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Direct interface with TTL levels
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Complies with JEDEC standard:
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JESD8-7A (1.65 V to 1.95 V)
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JESD8-5A (2.3 V to 2.7 V)
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JESD8-C/JESD36 (2.7 V to 3.6 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
74LVC00ABQ-Q100 | Production | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 4 | low | -40~125 | 109 | 23.4 | 77 | DHVQFN14 |
74LVC00AD-Q100 | Production | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 4 | low | -40~125 | 112 | 22.6 | 70 | SO14 |
74LVC00APW-Q100 | Production | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 2.1 | 150 | 4 | low | -40~125 | 144 | 8.7 | 70 | TSSOP14 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
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74LVC00ABQ-Q100 | DHVQFN14 (SOT762-1) | SOT762-1 | SOT762-1_115 | Active | VC00A | 74LVC00ABQ-Q100X ( 9353 003 52115 ) | |
74LVC00AD-Q100 | SO14 (SOT108-1) | SOT108-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT108-1_118 | Active | 74LVC00AD | 74LVC00AD-Q100J ( 9353 003 53118 ) |
74LVC00APW-Q100 | TSSOP14 (SOT402-1) | SOT402-1 | SSOP-TSSOP-VSO-WAVE | SOT402-1_118 | Active | LVC00A | 74LVC00APW-Q100J ( 9353 003 54118 ) |
停产信息
型号 | 可订购的器件编号,(订购码(12NC)) | 最后一次购买日期 | 最后一次交货日期 | 替代产品 | 状态 | 备注 |
---|---|---|---|---|---|---|
74LVC00APW-Q100/AU | 935690659118 | 2018-12-31 | 2019-06-30 | 74LVC00APW-Q100 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74LVC00ABQ-Q100 | 74LVC00ABQ-Q100X | 74LVC00ABQ-Q100 | Always Pb-free | ||
74LVC00AD-Q100 | 74LVC00AD-Q100J | 74LVC00AD-Q100 | Always Pb-free | ||
74LVC00APW-Q100 | 74LVC00APW-Q100J | 74LVC00APW-Q100 | Always Pb-free |
文档 (12)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LVC00A_Q100 | Quad 2-input NAND gate | Data sheet | 2024-02-08 |
AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
lvc00a | lvc00a IBIS model | IBIS model | 2013-04-07 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
样品
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