特性
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Automotive product qualification in accordance with AEC-Q100 (Grade 1)
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
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Wide supply voltage range from 0.8 V to 3.6 V
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CMOS low power dissipation
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High noise immunity
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Overvoltage tolerant inputs to 3.6 V
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Low static power consumption; ICC = 0.9 μA (maximum)
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Latch-up performance exceeds 100 mA per JESD 78 Class II
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Low noise overshoot and undershoot < 10 % of VCC
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IOFF circuitry provides partial Power-down mode operation
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Complies with JEDEC standards:
- JESD8-12 (0.8 V to 1.3 V)
- JESD8-11 (0.9 V to 1.65 V)
- JESD8-7 (1.65 V to 1.95 V)
- JESD8-5 (2.3 V to 2.7 V)
- JESD8C (2.7 V to 3.6 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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目标应用
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Wave and pulse shaper
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Astable multivibrator
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Monostable multivibrator
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|
74AUP1G14GW-Q100 | Production | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 1 | ultra low | -40~125 | 309 | 179 | TSSOP5 |
74AUP1G14GX4-Q100 | Production | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 1 | ultra low | -40~125 | - | 4 | X2SON4 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74AUP1G14GW-Q100 | TSSOP5 (SOT353-1) | SOT353-1 | WAVE_BG-BD-1 | SOT353-1_125 | Active | pF | 74AUP1G14GW-Q100H ( 9356 915 64125 ) |
74AUP1G14GX4-Q100 | X2SON4 (SOT1269-2) | SOT1269-2 | SOT1269-2_147 | Active | pF | 74AUP1G14GX4-Q100Z ( 9356 911 77147 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74AUP1G14GW-Q100 | 74AUP1G14GW-Q100H | 74AUP1G14GW-Q100 | |||
74AUP1G14GX4-Q100 | 74AUP1G14GX4-Q100Z | 74AUP1G14GX4-Q100 |
文档 (6)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AUP1G14_Q100 | Low-power Schmitt trigger inverter | Data sheet | 2023-10-27 |
aup1g14 | 74AUP1G14 IBIS model | IBIS model | 2018-05-25 |
74AUP1G14GX4-Q100_Nexperia_Product_Reliability | 74AUP1G14GX4-Q100 Nexperia Product Reliability | Quality document | 2023-05-29 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
SOT1269-2 | plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body | Package information | 2020-08-18 |
样品
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