特性
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Supply voltage range from 2.3 V to 3.6 V
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Overvoltage tolerant control inputs to 3.6 V
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High noise immunity
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Complies with JEDEC standard:
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JESD8-5 (2.3 V to 2.7 V)
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JESD8C (2.7 V to 3.6 V)
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ESD protection:
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HBM JESD22-A114F exceeds 2000 V
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MM JESD22-A115-A exceeds 200 V
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CDM JESD22-C101E exceeds 1000 V
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5 Ω switch connection between two ports
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Rail to rail switching on data I/O ports
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CMOS low power consumption
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Latch-up performance meets requirements of JESD78 Class I
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IOFF circuitry provides partial Power-down mode operation
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Multiple package options
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Specified from -40 °C to +85 °C and -40 °C to +125 °C
参数类型
Type number | Product status | VCC (V) | VPASS (V) | Logic switching levels | RON (Ω) | f(-3dB) (MHz) | Nr of bits | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
74CBTLV1G125GM | Production | 2.3 - 3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 1 | 0.2 | very low | -40~125 | 303 | 7.3 | 153 | XSON6 |
74CBTLV1G125GN | Production | 2.3 - 3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 1 | 0.2 | very low | -40~125 | 312 | 18.7 | 194 | XSON6 |
74CBTLV1G125GS | Production | 2.3 - 3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 1 | 0.2 | very low | -40~125 | 303 | 23.7 | 201 | XSON6 |
74CBTLV1G125GV | Production | 2.3 - 3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 1 | 0.2 | very low | -40~125 | 259 | 56.6 | 160 | TSOP5 |
74CBTLV1G125GW | Production | 2.3 - 3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 1 | 0.2 | very low | -40~125 | 300 | 71.7 | 171 | TSSOP5 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
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74CBTLV1G125GM | XSON6 (SOT886) | SOT886 | REFLOW_BG-BD-1 | SOT886_115 | Active | bM | 74CBTLV1G125GM,115 ( 9352 803 17115 ) |
74CBTLV1G125GN | XSON6 (SOT1115) | SOT1115 | REFLOW_BG-BD-1 | SOT1115_132 | Active | bM | 74CBTLV1G125GN,132 ( 9352 917 67132 ) |
74CBTLV1G125GS | XSON6 (SOT1202) | SOT1202 | REFLOW_BG-BD-1 | SOT1202_132 | Active | bM | 74CBTLV1G125GS,132 ( 9352 928 92132 ) |
74CBTLV1G125GV | TSOP5 (SOT753) | SOT753 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT753_125 | Active | b25 | 74CBTLV1G125GV,125 ( 9352 803 18125 ) |
74CBTLV1G125GW | TSSOP5 (SOT353-1) | SOT353-1 | WAVE_BG-BD-1 | SOT353-1_125 | Active | bM | 74CBTLV1G125GW,125 ( 9352 803 19125 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
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74CBTLV1G125GM | 74CBTLV1G125GM,115 | 74CBTLV1G125GM | Always Pb-free | ||
74CBTLV1G125GN | 74CBTLV1G125GN,132 | 74CBTLV1G125GN | Always Pb-free | ||
74CBTLV1G125GS | 74CBTLV1G125GS,132 | 74CBTLV1G125GS | Always Pb-free | ||
74CBTLV1G125GV | 74CBTLV1G125GV,125 | 74CBTLV1G125GV | Always Pb-free | ||
74CBTLV1G125GW | 74CBTLV1G125GW,125 | 74CBTLV1G125GW | Always Pb-free |
文档 (19)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74CBTLV1G125 | Single bus switch | Data sheet | 2022-02-12 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
cbtlv1g125 | CBTLV1G125 IBIS model | IBIS model | 2022-01-14 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
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模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
cbtlv1g125 | CBTLV1G125 IBIS model | IBIS model | 2022-01-14 |
样品
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