特性
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Wide supply voltage range from 1.4 V to 4.3 V
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Very low ON resistance (peak):
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1.6 Ω (typical) at VCC = 1.4 V
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1.0 Ω (typical) at VCC = 1.65 V
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0.55 Ω (typical) at VCC = 2.3 V
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0.5 Ω (typical) at VCC = 2.7 V
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0.5 Ω (typical) at VCC = 4.3 V
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Break-before-make switching
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High noise immunity
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ESD protection:
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HBM ANSI/ESDA/JEDEC JS-001 exceeds 4000 V
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CDM ANSI/ESDA/JEDEC JS-002 exceeds 1000 V
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IEC61000-4-2 contact discharge exceeds 8000 V for switch ports
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CMOS low-power consumption
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Latch-up performance exceeds 100 mA per JESD78 Class II Level A
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1.8 V control logic at VCC = 3.6 V
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Control input accepts voltages above supply voltage
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Very low supply current, even when input is below VCC
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High current handling capability (350 mA continuous current under 3.3 V supply)
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
目标应用
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Appliances
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Communication Systems
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Medical Equipment
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Analog Sensor Monitoring
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Audio Routing/Switching
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Test and Measurement
参数类型
Type number | Product status | Configuration | VCC (V) | Logic switching levels | RON (Ω) | RON(FLAT) (Ω) | f(-3dB) (MHz) | THD (%) | Xtalk (dB) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
XS3A4053PW | Production | SPDT-Z | 1.4 - 4.3 | CMOS/LVTTL | 0.5 | 0.13 | 40 | 0.04 | -90 | ultra low | -40~125 | 115 | 2.2 | 43.1 | TSSOP16 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
XS3A4053PW | TSSOP16 (SOT403-1) | SOT403-1 | SSOP-TSSOP-VSO-WAVE | SOT403-1_118 | Active | S3A4053 | XS3A4053PWJ ( 9356 912 41118 ) |
文档 (4)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
XS3A4053 | Triple low-ohmic single-pole double-throw analog switch | Data sheet | 2022-02-11 |
xs3a4053 | XS3A4053 IBIS model | IBIS model | 2022-02-14 |
SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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