特性
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Wide supply voltage range from 1.65 V to 5.5 V
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Very low ON resistance:
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7.5 Ω (typical) at VCC = 2.7 V
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6.5 Ω (typical) at VCC = 3.3 V
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6 Ω (typical) at VCC = 5 V
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Switch current capability of 32 mA
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High noise immunity
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CMOS low power consumption
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TTL interface compatibility at 3.3 V
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Latch-up performance meets requirements of JESD 78 Class I
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Control inputs accept voltages up to 5 V
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
参数类型
Type number | Product status | Configuration | VCC (V) | Logic switching levels | RON (Ω) | RON(FLAT) (Ω) | f(-3dB) (MHz) | THD (%) | Xtalk (dB) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
74LVC1G53DC | Production | SPDT-Z | 1.65 - 5.5 | CMOS/LVTTL | 15 | 1.5 | 300 | 0.078 | - | very low | -40~125 | 203 | 34.1 | 113 | VSSOP8 |
74LVC1G53DP | Production | SPDT-Z | 1.65 - 5.5 | CMOS/LVTTL | 15 | 1.5 | 300 | 0.078 | - | very low | -40~125 | 214 | 19.9 | 105 | TSSOP8 |
74LVC1G53GN | Production | SPDT-Z | 1.65 - 5.5 | CMOS/LVTTL | 15 | 1.5 | 300 | 0.078 | - | very low | -40~125 | 238 | 10.6 | 148 | XSON8 |
74LVC1G53GS | Production | SPDT-Z | 1.65 - 5.5 | CMOS/LVTTL | 15 | 1.5 | 300 | 0.078 | - | very low | -40~125 | 276 | 10.8 | 146 | XSON8 |
74LVC1G53GT | Production | SPDT-Z | 1.65 - 5.5 | CMOS/LVTTL | 15 | 1.5 | 300 | 0.078 | - | very low | -40~125 | 327 | 6.1 | 157 | XSON8 |
(-) dash denotes: "Parameter value not specified for this product"
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74LVC1G53DC | VSSOP8 (SOT765-1) | SOT765-1 | SOT765-1_125 | Active | V53 | 74LVC1G53DC,125 ( 9352 799 45125 ) | |
74LVC1G53DP | TSSOP8 (SOT505-2) | SOT505-2 | SOT505-2_125 | Active | V53 | 74LVC1G53DP,125 ( 9352 799 44125 ) | |
74LVC1G53GN | XSON8 (SOT1116) | SOT1116 | REFLOW_BG-BD-1 | SOT1116_115 | Active | V3 | 74LVC1G53GN,115 ( 9352 922 34115 ) |
74LVC1G53GS | XSON8 (SOT1203) | SOT1203 | REFLOW_BG-BD-1 | SOT1203_115 | Active | V3 | 74LVC1G53GS,115 ( 9352 923 78115 ) |
74LVC1G53GT | XSON8 (SOT833-1) | SOT833-1 | SOT833-1_115 | Active | V53 | 74LVC1G53GT,115 ( 9352 803 12115 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74LVC1G53DC | 74LVC1G53DC,125 | 74LVC1G53DC | Always Pb-free | ||
74LVC1G53DP | 74LVC1G53DP,125 | 74LVC1G53DP | Always Pb-free | ||
74LVC1G53GN | 74LVC1G53GN,115 | 74LVC1G53GN | Always Pb-free | ||
74LVC1G53GS | 74LVC1G53GS,115 | 74LVC1G53GS | Always Pb-free | ||
74LVC1G53GT | 74LVC1G53GT,115 | 74LVC1G53GT | Always Pb-free |
文档 (15)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LVC1G53 | 2-channel analog multiplexer/demultiplexer | Data sheet | 2024-04-30 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
lvc1g53 | 74LVC1G53 IBIS model | IBIS model | 2015-02-19 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SOT505-2 | plastic, thin shrink small outline package; 8 leads; 0.65 mm pitch; 3 mm x 3 mm x 1.1 mm body | Package information | 2022-06-03 |
MAR_SOT1203 | MAR_SOT1203 Topmark | Top marking | 2013-06-03 |
SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Package information | 2022-06-03 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Package information | 2022-06-03 |
MAR_SOT1116 | MAR_SOT1116 Topmark | Top marking | 2013-06-03 |
SOT1116 | plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body | Package information | 2022-06-02 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
样品
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