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PMGD175XNE

30 V, Dual N-channel Trench MOSFET

Dual N-channel enhancement mode Field-Effect Transistor (FET) in a very small SOT363 (TSSOP6) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.

Features and benefits

  • Low threshold voltage

  • Very fast switching

  • Trench MOSFET technology

  • ElectroStatic Discharge (ESD) protection > 2 kV HBM

Applications

  • Relay driver

  • High-speed line driver

  • Low-side load switch

  • Switching circuits

参数类型

型号 Package version Package name Product status Channel type Nr of transistors VDS [max] (V) VGS [max] (V) RDSon [max] @ VGS = 4.5 V (mΩ) RDSon [max] @ VGS = 2.5 V (mΩ) integrated gate-source ESD protection diodes Tj [max] (°C) ID [max] (A) QGD [typ] (nC) QG(tot) [typ] @ VGS = 4.5 V (nC) Ptot [max] (W) VGSth [typ] (V) Automotive qualified Ciss [typ] (pF) Coss [typ] (pF) Release date
PMGD175XNE SOT363 TSSOP6 Production N 2 30 12 252 319 N 150 0.95 0.26999998 1.05 0.26 1 N 81 13 2016-04-15

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
PMGD175XNE PMGD175XNEX
(934068835115)
Active LU% SOT363
TSSOP6
(SOT363)
SOT363 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT363_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
PMGD175XNE PMGD175XNEX PMGD175XNE rohs rhf rhf
品质及可靠性免责声明

文档 (17)

文件名称 标题 类型 日期
PMGD175XNE 30 V, Dual N-channel Trench MOSFET Data sheet 2024-02-02
AN10874_ZH LFPAK MOSFET thermal design guide, Chinese version Application note 2020-04-30
AN11113_ZH LFPAK MOSFET thermal design guide - Part 2 Application note 2020-04-30
AN11261 RC Thermal Models Application note 2021-03-18
AN11599 Using power MOSFETs in parallel Application note 2016-07-13
AN90032 Low temperature soldering, application study Application note 2022-02-22
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
SOT363 3D model for products with SOT363 package Design support 2018-12-05
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
TSSOP6_SOT363_mk plastic, surface-mounted package; 6 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body Marcom graphics 2017-01-28
SOT363 plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body Package information 2022-06-01
SOT363_115 TSSOP6; Reel pack for SMD, 7"; Q2/T3 product orientation Packing information 2020-06-12
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
PMGD175XNE_08_02_16 PMGD175XNE SPICE model SPICE model 2016-05-03
TN00008 Power MOSFET frequently asked questions and answers Technical note 2023-01-12
MAR_SOT363 MAR_SOT363 Topmark Top marking 2013-06-03
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
PMGD175XNE_08_02_16 PMGD175XNE SPICE model SPICE model 2016-05-03
SOT363 3D model for products with SOT363 package Design support 2018-12-05

订购、定价与供货

型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
PMGD175XNE PMGD175XNEX 934068835115 Active SOT363_115 3,000 订单产品

样品

作为 Nexperia 的客户,您可以通过我们的销售机构订购样品。

如果您没有 Nexperia 的直接账户,我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
PMGD175XNE PMGD175XNEX 934068835115 SOT363 订单产品
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