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PHPT61003NY

100 V, 3 A NPN high power bipolar transistor

PNP high power bipolar transistor in a SOT669 (LFPAK56) Surface-Mounted Device (SMD) power plastic package.

NPN complement: PHPT61003NY

Features and benefits

  • High thermal power dissipation capability

  • Suitable for high temperature applications up to 175 °C

  • Reduced Printed-Circuit Board (PCB) requirements comparing to transistors in DPAK

  • High energy efficiency due to less heat generation

  • AEC-Q101 qualified

Applications

  • Power management

  • Loadswitch

  • Linear mode voltage regulator

  • Backlighting applications

参数类型

型号 Package version Package name Product status VCEO [max] (V) IC [max] (A) hFE [min] hFE [typ] Polarity
PHPT61003NY SOT669 LFPAK56; Power-SO8 Production 100 3 150 250 NPN

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
PHPT61003NY PHPT61003NYX
(934067881115)
Active 1003NAB SOT669
LFPAK56; Power-SO8
(SOT669)
SOT669 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT669_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
PHPT61003NY PHPT61003NYX PHPT61003NY rohs rhf
品质及可靠性免责声明

文档 (12)

文件名称 标题 类型 日期
PHPT61003NY 100 V, 3 A NPN high power bipolar transistor Data sheet 2020-09-10
AN11641 Relay replacement by NXP high-power bipolar transistors in LFPAK56 Application note 2015-05-21
SOT669 3D model for products with SOT669 package Design support 2017-06-30
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
LFPAK56_POWER-SO8_SOT669_mk plastic, single-ended surface-mounted package; 4 terminals; 4.9 mm x 4.45 mm x 1 mm body Marcom graphics 2017-01-28
SOT669 plastic, single-ended surface-mounted package; 4 terminals Package information 2022-05-30
SOT669_115 LFPAK56; Reel pack for SMD, 7"; Q1/T1 product orientation Packing information 2022-05-10
PHPT61003NY_Nexperia_Product_Quality PHPT61003NY Nexperia Product Quality Quality document 2019-05-20
PHPT61003NY_Nexperia_Product_Reliability PHPT61003NY Nexperia Product Reliability Quality document 2024-04-23
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
PHPT61003NY PHPT61003NY SPICE model SPICE model 2024-04-05
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
PHPT61003NY PHPT61003NY SPICE model SPICE model 2024-04-05
SOT669 3D model for products with SOT669 package Design support 2017-06-30

订购、定价与供货

型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
PHPT61003NY PHPT61003NYX 934067881115 Active SOT669_115 1,500 订单产品

样品

作为 Nexperia 的客户,您可以通过我们的销售机构订购样品。

如果您没有 Nexperia 的直接账户,我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
PHPT61003NY PHPT61003NYX 934067881115 SOT669 订单产品
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