NG体育娱乐,ng体育平台

×

SOT519-1

SOT519-1

plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body

外形图

封装版本 封装名称 封装说明 参考 发行日期
SOT519-1 SSOP16 plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body 2003-02-18

相关文档

文件名称 标题 类型 日期
SOT519-1 3D model for products with SOT519-1 package Design support 2023-02-07
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
SOT519-1 plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body Package information 2022-06-20
SOT519-1_118 SSOP16; Reel pack for SMD, 13''; Q1/T1 product orientation Packing information 2020-04-21
SSOP-TSSOP-VSO-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

采用此封装的产品

Analog & Logic ICs

型号 描述 快速访问
74CBTLV3126DS 4-bit bus switch
74CBTLV3257DS Quad 1-of-2 multiplexer/demultiplexer
74CBTLV3125DS 4-bit bus switch
CBT3253ADS Dual 1-of-4 FET multiplexer/demultiplexer
74CBTLV3253DS Dual 1-of-4 multiplexer/demultiplexer
CBT3257ADS Quad 1-of-2 multiplexer/demultiplexer

Automotive qualified products (AEC-Q100/Q101)

型号 描述 快速访问
NG体育娱乐,ng体育平台