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SOT364-1

SOT364-1

plastic, thin shrink small outline package; 56 leads; 0.5 mm pitch; 14 mm x 6.1 mm x 1.2 mm body

外形图

封装版本 封装名称 封装说明 参考 发行日期
SOT364-1 TSSOP56 plastic, thin shrink small outline package; 56 leads; 0.5 mm pitch; 14 mm x 6.1 mm x 1.2 mm body MO-153 (JEDEC) 2003-02-19

相关文档

文件名称 标题 类型 日期
SOT364-1 3D model for products with SOT364-1 package Design support 2020-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
SOT364-1 plastic, thin shrink small outline package; 56 leads; 0.5 mm pitch; 14 mm x 6.1 mm x 1.2 mm body Package information 2022-06-23
SOT364-1_118 TSSOP56; Reel pack for SMD, 13"; Q1/T1 product orientation Packing information 2020-04-21
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

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