外形图
封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
---|---|---|---|---|
OL-PCMF3HDMI2BA-C | WLCSP15 | wafer level chip-size package; 15 bumps (6-3-6) | 2020-05-06 |
相关文档
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
OL-PCMF3HDMI2BA-C | 3D model for products with OL-PCMF3HDMI2BA-C package | Design support | 2023-03-13 |
RS3303_WLCSP15 | RS3303_WLCSP15 | Marcom graphics | 2021-03-11 |
OL-PCMF3HDMI2BA-C | wafer level chip-size package; 15 bumps (6-3-6) | Package information | 2022-01-04 |
采用此封装的产品
ESD protection, TVS, filtering and signal conditioning
型号 | 描述 | 快速访问 |
---|---|---|
PCMF3HDMI2BA-C | Common-mode EMI filter for differential channels with integrated bidirectional ESD protection |