NG体育娱乐,ng体育平台

×

OL-PCMF3HDMI2BA-C

OL-PCMF3HDMI2BA-C

wafer level chip-size package; 15 bumps (6-3-6)

外形图

封装版本 封装名称 封装说明 参考 发行日期
OL-PCMF3HDMI2BA-C WLCSP15 wafer level chip-size package; 15 bumps (6-3-6) 2020-05-06

相关文档

文件名称 标题 类型 日期
OL-PCMF3HDMI2BA-C 3D model for products with OL-PCMF3HDMI2BA-C package Design support 2023-03-13
RS3303_WLCSP15 RS3303_WLCSP15 Marcom graphics 2021-03-11
OL-PCMF3HDMI2BA-C wafer level chip-size package; 15 bumps (6-3-6) Package information 2022-01-04

采用此封装的产品

ESD protection, TVS, filtering and signal conditioning

型号 描述 快速访问
PCMF3HDMI2BA-C Common-mode EMI filter for differential channels with integrated bidirectional ESD protection
NG体育娱乐,ng体育平台