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74AUP2G0604

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP2G0604GMProduction0.8 - 3.6CMOS± 1.9702ultra low-40~1252906.5145XSON6
74AUP2G0604GNProduction0.8 - 3.6CMOS± 1.9702ultra low-40~12527511.7171XSON6
74AUP2G0604GSProduction0.8 - 3.6CMOS± 1.9702ultra low-40~12527214.8177XSON6
74AUP2G0604GWProduction0.8 - 3.6CMOS± 1.9702ultra low-40~12526438.6153TSSOP6

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号,(订购码(12NC))
74AUP2G0604GM
XSON6
(SOT886)
SOT886REFLOW_BG-BD-1
SOT886_125Activea674AUP2G0604GMH
( 9352 996 53125 )
74AUP2G0604GN
XSON6
(SOT1115)
SOT1115REFLOW_BG-BD-1
SOT1115_125Activea674AUP2G0604GNH
( 9352 996 54125 )
74AUP2G0604GS
XSON6
(SOT1202)
SOT1202REFLOW_BG-BD-1
SOT1202_125Activea674AUP2G0604GSH
( 9352 996 55125 )
74AUP2G0604GW
TSSOP6
(SOT363-2)
SOT363-2SOT363-2_125Activea674AUP2G0604GWH
( 9352 996 56125 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP2G0604GM74AUP2G0604GMH74AUP2G0604GMAlways Pb-free
74AUP2G0604GN74AUP2G0604GNH74AUP2G0604GNAlways Pb-free
74AUP2G0604GS74AUP2G0604GSH74AUP2G0604GSAlways Pb-free
74AUP2G0604GW74AUP2G0604GWH74AUP2G0604GWAlways Pb-free
品质及可靠性免责声明

文档 (10)

文件名称标题类型日期
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

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样品

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