NG体育娱乐,ng体育平台

×

74LVC1G98

Low-power configurable multiple function gate

The 74LVC1G98 is a configurable multiple function gate with Schmitt-trigger inputs. The device can be configured as any of the following logic functions MUX, AND, OR, NAND, NOR, inverter and buffer; using the 3-bit input. All inputs can be connected to VCC or GND.

Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 1.65 V to 5.5 V

  • 5 V tolerant input/output for interfacing with 5 V logic

  • High noise immunity

  • ±24 mA output drive (VCC = 3.0 V)

  • CMOS low power dissipation

  • IOFF circuitry provides partial Power-down mode operation

  • Direct interface with TTL levels

  • Inputs accept voltages up to 5 V

  • Latch-up performance exceeds 250 mA

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD36 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C.

参数类型

Type numberProduct statusVCC(A) (V)VCC(B) (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74LVC1G98GMProductionn.a.n.a.TTL± 326.31501low-40~1253087.5155XSON6
74LVC1G98GNProductionn.a.n.a.TTL± 326.31501low-40~12532521.0201XSON6
74LVC1G98GSProductionn.a.n.a.TTL± 326.31501low-40~12531326.6209XSON6
74LVC1G98GVProductionn.a.n.a.TTL± 326.31501low-40~12523743.9150TSOP6
74LVC1G98GWProductionn.a.n.a.TTL± 326.31501low-40~12527750.1165TSSOP6

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号,(订购码(12NC))
74LVC1G98GM
XSON6
(SOT886)
SOT886REFLOW_BG-BD-1
SOT886_132ActiveV974LVC1G98GM,132
( 9352 931 93132 )
74LVC1G98GN
XSON6
(SOT1115)
SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveV974LVC1G98GN,132
( 9352 931 94132 )
74LVC1G98GS
XSON6
(SOT1202)
SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveV974LVC1G98GS,132
( 9352 931 95132 )
74LVC1G98GV
TSOP6
(SOT457)
SOT457REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT457_125ActiveV9874LVC1G98GV,125
( 9352 931 96125 )
74LVC1G98GW
TSSOP6
(SOT363-2)
SOT363-2SOT363-2_125ActiveV974LVC1G98GW,125
( 9352 931 97125 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74LVC1G98GM74LVC1G98GM,13274LVC1G98GMAlways Pb-free
74LVC1G98GN74LVC1G98GN,13274LVC1G98GNAlways Pb-free
74LVC1G98GS74LVC1G98GS,13274LVC1G98GSAlways Pb-free
74LVC1G98GV74LVC1G98GV,12574LVC1G98GVAlways Pb-free
74LVC1G98GW74LVC1G98GW,12574LVC1G98GWAlways Pb-free
品质及可靠性免责声明

文档 (19)

文件名称标题类型日期
74LVC1G98Low-power configurable multiple function gateData sheet2023-08-22
AN11009Pin FMEA for LVC familyApplication note2019-01-09
lvc1g9874LVC1G98 IBIS modelIBIS model2014-10-20
Nexperia_document_leaflet_Logic_SingleConfigurableLogic_201812Single configurable logicLeaflet2019-01-04
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT457MAR_SOT457 TopmarkTop marking2013-06-03
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT457plastic, surface-mounted package (SC-74; TSOP6); 6 leadsPackage information2023-03-03
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

如果您需要设计/技术支持,请告知我们并填写 应答表, 我们会尽快回复您。

模型

文件名称标题类型日期
lvc1g9874LVC1G98 IBIS modelIBIS model2014-10-20

样品

安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品: https://extranet.nexperia.com.

样品订单通常需要2-4天寄送时间。

如果您尚未取得安世半导体的直接采购帐号,我们的全球与区域经销网络可以协助您取得样品

NG体育娱乐,ng体育平台