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    PBSS5230PAP

    30 V, 2 A PNP/PNP low VCEsat (BISS) transistor

    PNP/PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a leadless medium power DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic package.

    NPN/PNP complement: PBSS4230PANP. NPN/NPN complement: PBSS4230PAN.

    Features and benefits

    • Very low collector-emitter saturation voltage VCEsat

    • High collector current capability IC and ICM

    • High collector current gain hFE at high IC

    • Reduced Printed-Circuit Board (PCB) requirements

    • High energy efficiency due to less heat generation

    • AEC-Q101 qualified

    Applications

    • Load switch

    • Battery-driven devices

    • Power management

    • Charging circuits

    • Power switches (e.g. motors, fans)

    参数类型

    型号 Package version Package name Size (mm) Product status Polarity Nr of transistors Ptot [max] (mW) VCEO [max] (V) IC [max] (A) VCEsat [max] (PNP) (mV) RCEsat@IC [max]; IC/IB =10 [typ] (mΩ) hFE [min] fT [typ] (MHz)
    PBSS5230PAP SOT1118 DFN2020-6 2 x 2 x 0.65 Production PNP 2 1040 -30 -2 -390 195 260 95

    封装

    型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
    PBSS5230PAP PBSS5230PAP,115
    (934066884115)
    Active 2H SOT1118
    DFN2020-6
    (SOT1118)
    SOT1118 REFLOW_BG-BD-1
    SOT1118_115

    环境信息

    型号 可订购的器件编号 化学成分 RoHS RHF指示符
    PBSS5230PAP PBSS5230PAP,115 PBSS5230PAP rohs rhf rhf
    品质及可靠性免责声明

    文档 (10)

    文件名称 标题 类型 日期
    PBSS5230PAP 30 V, 2 A PNP/PNP low VCEsat (BISS) transistor Data sheet 2017-05-22
    SOT1118 3D model for products with SOT1118 package Design support 2019-10-07
    Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
    DFN2020-6_SOT1118_mk plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body Marcom graphics 2017-01-28
    SOT1118 plastic, leadless thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body Package information 2022-06-02
    SOT1118_115 DFN2020-6; Reel pack for SMD, 7''; Q2/T3 product orientation Packing information 2020-06-12
    PBSS5230PAP_Nexperia_Product_Quality PBSS5230PAP Nexperia Product Quality Quality document 2019-05-20
    PBSS5230PAP_Nexperia_Product_Reliability PBSS5230PAP Nexperia Product Reliability Quality document 2024-04-23
    REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
    PBSS5230PAP PBSS5230PAP SPICE model SPICE model 2024-04-05

    支持

    如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

    模型

    文件名称 标题 类型 日期
    PBSS5230PAP PBSS5230PAP SPICE model SPICE model 2024-04-05
    SOT1118 3D model for products with SOT1118 package Design support 2019-10-07

    订购、定价与供货

    型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
    PBSS5230PAP PBSS5230PAP,115 934066884115 Active SOT1118_115 3,000 订单产品

    样品

    作为 Nexperia 的客户,您可以通过我们的销售机构订购样品。

    如果您没有 Nexperia 的直接账户,我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。

    How does it work?

    The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

    可订购部件

    型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
    PBSS5230PAP PBSS5230PAP,115 934066884115 SOT1118 订单产品
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