可订购部件
型号 | 可订购的器件编号 | 订购代码(12NC) | 封装 | 从经销商处购买 |
---|---|---|---|---|
PBSS5360PAS-Q | PBSS5360PAS-QX | 934664536115 | SOT1061D | 订单产品 |
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Click here for more informationLow collector-emitter saturation voltage VCEsat
High collector current capability IC and ICM
High collector current gain (hFE) at high IC
High efficiency due to less heat generation
High temperature applications up to 175 °C
Reduced Printed-Circuit Board (PCB) area requirements
Leadless small SMD plastic package with soldarable side pads
Exposed heat sink for excellent thermal and electrical conductivity
Suitable for Automatic Optical Inspection (AOI) of solder joint
Qualified according to AEC-Q101 and recommended for use in automotive applications
Loadswitch
Battery-driven devices
Power management
Charging circuits
Power switches (e.g. motors, fans)
型号 | Package version | Package name | Size (mm) | Polarity | Ptot [max] (mW) | VCEO [max] (V) | IC [max] (A) | ICM [max] (A) | hFE [min] | hFE [typ] | fT [min] (MHz) | fT [typ] (MHz) | VCEsat [max] (mV) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PBSS5360PAS-Q | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | PNP | 2500 | -60 | -3 | -6 | 150 | 250 | 65 | 120 | -450 |
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
PBSS5360PAS-Q | PBSS5360PAS-QX (934664536115) |
Active | EA |
DFN2020D-3 (SOT1061D) |
SOT1061D |
REFLOW_BG-BD-1
|
SOT1061D_115 |
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PBSS5360PAS-Q | 60 V, 3A PNP low VCEsat transistor | Data sheet | 2022-05-11 |
AN90023 | Thermal performance of DFN packages | Application note | 2020-11-23 |
AN90023_ZH | Thermal performance of DFN packages | Application note | 2021-02-26 |
Nexperia_asset_document_brochure_autoDFN_CN_LR | 小巧轻便的汽车 二极管和晶体管 | Brochure | 2022-04-26 |
SOT1061D | 3D model for products with SOT1061D package | Design support | 2021-07-30 |
Nexperia_AutoDFN_factsheet_2022 | Small & light automotive diodes and transistors | Leaflet | 2022-04-13 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN2020D-3_SOT1061D_mk | plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
SOT1061D | plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-10-10 |
SOT1061D_115 | DFN2020D-3; Reel pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2020-05-29 |
PBSS5360PAS-Q_Nexperia_Product_Reliability | PBSS5360PAS-Q Nexperia Product Reliability | Quality document | 2024-04-23 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
PBSS5360PAS-Q | PBSS5360PAS-Q SPICE model | SPICE model | 2024-04-05 |
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PBSS5360PAS-Q | PBSS5360PAS-Q SPICE model | SPICE model | 2024-04-05 |
SOT1061D | 3D model for products with SOT1061D package | Design support | 2021-07-30 |
型号 | Orderable part number | Ordering code (12NC) | 状态 | 包装 | Packing Quantity | 在线购买 |
---|---|---|---|---|---|---|
PBSS5360PAS-Q | PBSS5360PAS-QX | 934664536115 | Active | SOT1061D_115 | 3,000 | 订单产品 |
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如果您没有 Nexperia 的直接账户,我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.