可订购部件
型号 | 可订购的器件编号 | 订购代码(12NC) | 封装 | 从经销商处购买 |
---|---|---|---|---|
BUK6Y61-60P | BUK6Y61-60PX | 934661185115 | SOT669 | 订单产品 |
Register once, drag and drop ECAD models into your CAD tool and speed up your design.
Click here for more information60 V, P-channel Trench MOSFET
P-channel enhancement mode MOSFET in an LFPAK56 (Power SO8) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
This product has been designed and qualified to AEC-Q101 standard for use in high-performance automotive applications such as reverse battery protection.
High thermal power dissipation capability
Suitable for thermally demanding environments due to 175 °C rating
Trench MOSFET technology
AEC-Q101 qualified
Reverse battery protection
Power management
High-side load switch
Motor drive
型号 | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 4.5 V (mΩ) | Tj [max] (°C) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Release date |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
BUK6Y61-60P | SOT669 | LFPAK56; Power-SO8 | Production | P | 1 | -60 | 61 | 93 | 175 | 4.2999997 | 20 | 66 | 37 | -2 | Y | 1060 | 85 | 2020-03-16 |
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
BUK6Y61-60P | BUK6Y61-60PX (934661185115) |
Active | 6Y6160P |
LFPAK56; Power-SO8 (SOT669) |
SOT669 |
REFLOW_BG-BD-1
WAVE_BG-BD-1 |
SOT669_115 |
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
BUK6Y61-60P | 60 V, P-channel Trench MOSFET | Data sheet | 2020-03-16 |
AN10273 | Power MOSFET single-shot and repetitive avalanche ruggedness rating | Application note | 2022-06-20 |
AN11158 | Understanding power MOSFET data sheet parameters | Application note | 2020-07-06 |
AN11599 | Using power MOSFETs in parallel | Application note | 2016-07-13 |
AN90003 | LFPAK MOSFET thermal design guide | Application note | 2023-08-22 |
SOT669 | 3D model for products with SOT669 package | Design support | 2017-06-30 |
SOT669 | 3D model for products with SOT669 package | Design support | 2017-06-30 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
LFPAK56_POWER-SO8_SOT669_mk | plastic, single-ended surface-mounted package; 4 terminals; 4.9 mm x 4.45 mm x 1 mm body | Marcom graphics | 2017-01-28 |
SOT669 | plastic, single-ended surface-mounted package; 4 terminals | Package information | 2022-05-30 |
SOT669_115 | LFPAK56; Reel pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2022-05-10 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
BUK6Y61-60P | BUK6Y61-60P SPICE model | SPICE model | 2020-04-01 |
BUK6Y61-60P | BUK6Y61-60P Thermal model | Thermal model | 2020-08-12 |
BUK6Y61-60P_Cauer | BUK6Y61-60P Cauer thermal model | Thermal model | 2020-08-12 |
BUK6Y61-60P_Foster | BUK6Y61-60P Foster thermal model | Thermal model | 2020-08-12 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT669 | 3D model for products with SOT669 package | Design support | 2017-06-30 |
BUK6Y61-60P | BUK6Y61-60P SPICE model | SPICE model | 2020-04-01 |
BUK6Y61-60P | BUK6Y61-60P Thermal model | Thermal model | 2020-08-12 |
BUK6Y61-60P_Cauer | BUK6Y61-60P Cauer thermal model | Thermal model | 2020-08-12 |
BUK6Y61-60P_Foster | BUK6Y61-60P Foster thermal model | Thermal model | 2020-08-12 |
SOT669 | 3D model for products with SOT669 package | Design support | 2017-06-30 |
型号 | Orderable part number | Ordering code (12NC) | 状态 | 包装 | Packing Quantity | 在线购买 |
---|---|---|---|---|---|---|
BUK6Y61-60P | BUK6Y61-60PX | 934661185115 | Active | SOT669_115 | 1,500 | 订单产品 |
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The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.