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74AVC1T45GM-Q100

Dual-supply voltage level translator/transceiver; 3-state

The 74AVC1T45-Q100 is a single bit, dual supply transceiver with 3-state output that enables bidirectional level translation. It features two 1-bit input-output ports (A and B), a direction control input (DIR) and dual supply pins (VCC(A) and VCC(B)). Both VCC(A) and VCC(B) can be supplied at any voltage between 0.8 V and 3.6 V making the device suitable for translating between any of the low voltage nodes (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V and 3.3 V). Pins A and DIR are referenced to VCC(A) and pin B is referenced to VCC(B). A HIGH on DIR allows transmission from A to B and a LOW on DIR allows transmission from B to A.

The device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing any damaging backflow current through the device when it is powered down. In suspend mode when either VCC(A) or VCC(B) are at GND level, both A and B are in the high-impedance OFF-state.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range:

    • VCC(A): 0.8 V to 3.6 V

    • VCC(B): 0.8 V to 3.6 V

  • High noise immunity

  • CMOS low power dissipation

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11( 0.9 V to 1.65 V)

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

  • ESD protection:

    • MIL-STD-883, method 3015 Class 3B exceeds 8000 V

    • HBM JESD22-A114E Class 3B exceeds 8000 V

    • MM JESD22-A115-A exceeds 200 V (C = 200 pF; R = 0 Ω)

  • Maximum data rates:

    • 500 Mbit/s (1.8 V to 3.3 V translation)

    • 320 Mbit/s (< 1.8 V to 3.3 V translation)

    • 320 Mbit/s (translate to 2.5 V or 1.8 V)

    • 280 Mbit/s (translate to 1.5 V)

    • 240 Mbit/s (translate to 1.2 V)

  • Suspend mode

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Overvoltage tolerant inputs to 3.6 V

  • Dynamically controlled outputs

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • Multiple package options

参数类型

型号 Product status VCC(A) (V) VCC(B) (V) Logic switching levels Output drive capability (mA) tpd (ns) Nr of bits Power dissipation considerations Tamb (°C) Rth(j-a) (K/W) Ψth(j-top) (K/W) Rth(j-c) (K/W) Package name
74AVC1T45GM-Q100 Production 0.8 - 3.6 0.8 - 3.6 CMOS/LVTTL ± 12 2.1 1 very low -40~125 286 6.3 142 XSON6

PCB Symbol, Footprint and 3D Model

Model Name 描述

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74AVC1T45GM-Q100 74AVC1T45GM-Q100H
(935299489125)		 Active B5 SOT886
XSON6
(SOT886) 		SOT886 REFLOW_BG-BD-1
SOT886_125

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74AVC1T45GM-Q100 74AVC1T45GM-Q100H 74AVC1T45GM-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (16)

文件名称 标题 类型 日期
74AVC1T45_Q100 Dual-supply voltage level translator/transceiver; 3-state Data sheet 2022-02-02
AN10161 PicoGate Logic footprints Application note 2002-10-29
AN90007 Pin FMEA for AVC family Application note 2018-11-30
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
avc1t45 74AVC1T45 IBIS model IBIS model 2016-02-24
Nexperia_document_leaflet_Logic_Automotive_MicroPak_solutions_201904 Automotive logic in MicroPak leadless packages Leaflet 2019-04-18
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
sot886_3d_logo sot886 3D logo Logo 2018-09-19
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT886_125 XSON6; Reel pack for SMD, 7''; Q3/T4 product orientation Packing information 2022-12-21
74AVC1T45GM-Q100_Nexperia_Product_Reliability 74AVC1T45GM-Q100 Nexperia Product Reliability Quality document 2023-05-29
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03

支持

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模型

文件名称 标题 类型 日期
avc1t45 74AVC1T45 IBIS model IBIS model 2016-02-24
SOT886 3D model for products with SOT886 package Design support 2019-10-03

PCB Symbol, Footprint and 3D Model

Model Name 描述

订购、定价与供货

型号 Orderable part number Ordering code (12NC) 状态 包装 Packing Quantity 在线购买
74AVC1T45GM-Q100 74AVC1T45GM-Q100H 935299489125 Active SOT886_125 5,000 订单产品

样品

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How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

可订购部件

型号 可订购的器件编号 订购代码(12NC) 封装 从经销商处购买
74AVC1T45GM-Q100 74AVC1T45GM-Q100H 935299489125 SOT886 订单产品
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