外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| SOT974-2 | DFN3314-16 | plastic, leadless thermal enhanced extremely thin small outline package; 16 terminals; 0.4 mm pitch; 3.3 mm x 1.35 mm x 0.5 mm body | 2010-03-25 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT974-2 | 3D model for products with SOT974-2 package | Design support | 2023-03-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT974-2 | plastic, leadless thermal enhanced extremely thin small outline package; 16 terminals; 0.4 mm pitch; 3.3 mm x 1.35 mm x 0.5 mm body | Package information | 2022-06-15 |
| SOT974-2_132 | DFN3314-16; Reel pack for SMD, 7''; Q1/T1 product orientation | Packing information | 2020-12-16 |
采用此封装的产品
ESD protection, TVS, filtering and signal conditioning
| 型号 | 描述 | 快速访问 |
|---|