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SOT8044-1

SOT8044-1

plastic thermal enhanced very very thin Small Outline packages, no leads; 6 terminals; 0.65 mm pitch; 2.0 mm x 2.0 mm x 0.75 mm body

外形图

封装版本 封装名称 封装说明 参考 发行日期
SOT8044-1 HWSON6 plastic thermal enhanced very very thin Small Outline packages, no leads; 6 terminals; 0.65 mm pitch; 2.0 mm x 2.0 mm x 0.75 mm body MO-229 (JEDEC) 2023-10-02

相关文档

文件名称 标题 类型 日期
SOT8044-1 plastic thermal enhanced very very thin Small Outline packages, no leads;6 terminals; 0.65 mm pitch; 2.0 mm x 2.0 mm x 0.75 mm body Package information 2023-12-04
SOT8044-1_147 DFN2020-6; Reel pack for SMD, 7"; Q2/T3 product orientation Packing information 2023-01-17

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