外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| SOT8044-1 | HWSON6 | plastic thermal enhanced very very thin Small Outline packages, no leads; 6 terminals; 0.65 mm pitch; 2.0 mm x 2.0 mm x 0.75 mm body | MO-229 (JEDEC) | 2023-10-02 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT8044-1 | plastic thermal enhanced very very thin Small Outline packages, no leads;6 terminals; 0.65 mm pitch; 2.0 mm x 2.0 mm x 0.75 mm body | Package information | 2023-12-04 |
| SOT8044-1_147 | DFN2020-6; Reel pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2023-01-17 |