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SOT8017

SOT8017

Plastic, single-ended surface-mounted package (DPAK R2P); Real-2-Pin configuration; 4.58 mm pitch; 6.16 mm x 6.54 mm x 2.29 mm body

外形图

封装版本 封装名称 封装说明 参考 发行日期
SOT8017 DPAK R2P Plastic, single-ended surface-mounted package (DPAK R2P); Real-2-Pin configuration; 4.58 mm pitch; 6.16 mm x 6.54 mm x 2.29 mm body TO-252 (JEDEC) 2024-01-17

相关文档

文件名称 标题 类型 日期
SOT8017 3D model for products with SOT8017 package Design support 2023-03-13
SOT8017 Plastic, single-ended surface-mounted package (DPAK R2P); Real-2-Pin configuration; 4.58 mm pitch; 6.16 mm x 6.54 mm x 2.29 mm body Package information 2024-01-30
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

采用此封装的产品

Diodes

型号 描述 快速访问
PSC1065H 650 V, 10 A SiC Schottky diode in DPAK R2P
PSC1065H-Q 650 V, 10 A SiC Schottky diode in DPAK R2P for automotive applications

SiC MOSFETs

型号 描述 快速访问
PSC1065H-Q 650 V, 10 A SiC Schottky diode in DPAK R2P for automotive applications
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