特性
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Symmetrical output impedance
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High noise immunity
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Low power dissipation
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Balanced propagation delays
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CMOS input levels
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
参数类型
| Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|
| XC7SH125GM | Production | 2.0 - 5.5 | CMOS | ± 8 | 60 | 1 | low | -40~125 | 318 | 161 | XSON6 |
| XC7SH125GV | Production | 2.0 - 5.5 | CMOS | ± 8 | 60 | 1 | low | -40~125 | 276 | 173 | TSOP5 |
| XC7SH125GW | Production | 2.0 - 5.5 | CMOS | ± 8 | 60 | 1 | low | -40~125 | 317 | 186 | TSSOP5 |
封装
| 型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号，（订购码(12NC)） |
|---|---|---|---|---|---|---|---|
| XC7SH125GM |  XSON6 (SOT886) | SOT886 | REFLOW_BG-BD-1 | SOT886_132 | Active | fM | XC7SH125GM,132 ( 9352 898 84132 ) |
| SOT886_115 | Active | fM | XC7SH125GM,115 ( 9352 898 84115 ) | ||||
| XC7SH125GV |  TSOP5 (SOT753) | SOT753 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT753_125 | Active | f25 | XC7SH125GV,125 ( 9352 898 85125 ) |
| XC7SH125GW |  TSSOP5 (SOT353-1) | SOT353-1 | WAVE_BG-BD-1 | SOT353-1_125 | Active | fM | XC7SH125GW,125 ( 9352 898 86125 ) |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
|---|---|---|---|---|---|
| XC7SH125GM | XC7SH125GM,132 | XC7SH125GM |  |   | Always Pb-free |
| XC7SH125GM | XC7SH125GM,115 | XC7SH125GM | | | Always Pb-free |
| XC7SH125GV | XC7SH125GV,125 | XC7SH125GV | | | Always Pb-free |
| XC7SH125GW | XC7SH125GW,125 | XC7SH125GW | | | Always Pb-free |
文档 (12)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| XC7SH125 | Bus buffer/line driver; 3-state | Data sheet | 2024-01-03 |
| xc7sh125 | xc7sh125 IBIS model | IBIS model | 2013-04-07 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
| SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
订购、定价与供货
样品
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