特性
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Automotive product qualification in accordance with AEC-Q100 (Grade 1)
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
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5 V tolerant inputs/outputs, for interfacing with 5 V logic
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Wide supply voltage range:
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3 V bus (VCC(B)): 1.5 V to 3.6 V
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5 V bus (VCC(A)): 1.5 V to 5.5 V
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CMOS low-power consumption
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TTL interface capability at 3.3 V
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Overvoltage tolerant control inputs to 5.5 V
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High-impedance when VCC(A) = 0 V
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Complies with JEDEC standard no. JESD8B/JESD36
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Latch-up performance meets requirements of JESD78 Class 1
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Multiple package options
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DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
参数类型
Type number | Product status | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
74LVC4245ABQ-Q100 | Production | 1.2 - 5.5 | 1.2 - 5.5 | CMOS/LVTTL | ± 24 | 3.5 | 8 | low | -40~125 | 73 | 8.0 | 46 | DHVQFN24 |
74LVC4245APW-Q100 | Production | 1.5 - 5.5 | 1.5 - 3.6 | CMOS/LVTTL | ± 24 | 4 | 8 | low | -40~125 | 83 | 2.5 | 37 | TSSOP24 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
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74LVC4245ABQ-Q100 | DHVQFN24 (SOT815-1) | SOT815-1 | SOT815-1_118 | Active | LVC4245A | 74LVC4245ABQ-Q100J ( 9353 053 04118 ) | |
74LVC4245APW-Q100 | TSSOP24 (SOT355-1) | SOT355-1 | SSOP-TSSOP-VSO-WAVE | SOT355-1_118 | Active | LVC4245A | 74LVC4245APW-Q100J ( 9353 053 03118 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
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74LVC4245ABQ-Q100 | 74LVC4245ABQ-Q100J | 74LVC4245ABQ-Q100 | Always Pb-free | ||
74LVC4245APW-Q100 | 74LVC4245APW-Q100J | 74LVC4245APW-Q100 | Always Pb-free |
文档 (8)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LVC4245A_Q100 | Octal dual supply translating transceiver; 3-state | Data sheet | 2023-09-01 |
AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
lvc4245a | lvc4245a IBIS model | IBIS model | 2013-04-07 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SOT355-1 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-22 |
SOT815-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 24 terminals; 0.5 mm pitch; 5.5 mm x 3.5 mm x 1 mm body | Package information | 2021-08-17 |
样品
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