特性
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Wide supply voltage range from 0.7 V to 2.75 V
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Low input capacitance; CI = 0.5 pF (typical)
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Low output capacitance; CO = 1.0 pF (typical)
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Low dynamic power consumption; CPD = 2.5 pF at VCC = 1.2 V (typical)
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Low static power consumption; ICC = 0.6 μA (85 °C maximum)
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High noise immunity
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Complies with JEDEC standard:
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JESD8-12A.01 (1.1 V to 1.3 V)
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JESD8-11A.01 (1.4 V to 1.6 V)
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JESD8-7A (1.65 V to 1.95 V)
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JESD8-5A.01 (2.3 V to 2.7 V)
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ESD protection:
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HBM ANSI/ESDA/JEDEC JS-001 Class 2 exceeds 2 kV
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CDM JESD22-C101E exceeds 1000 V
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Latch-up performance exceeds 100 mA per JESD 78 Class II
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Inputs accept voltages up to 2.75 V
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Low noise overshoot and undershoot < 10 % of VCC
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IOFF circuitry provides partial Power-down mode operation
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Multiple package options
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Specified from -40 °C to +85 °C
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|
74AXP1G125GX NRND | Not for design in | 0.7 - 2.75 | CMOS | ± 4.5 | 70 | 1 | ultra low | -40~85 | 352 | 217 | X2SON5 |
封装
下表中的所有产品型号已停产。参见表 停产信息 了解更多信息。
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74AXP1G125GX | X2SON5 (SOT1226) | SOT1226 | REFLOW_BG-BD-1 | SOT1226_125 | Discontinued / End-of-life | rM | 74AXP1G125GXH ( 9353 032 11125 ) |
停产信息
型号 | 可订购的器件编号,(订购码(12NC)) | 最后一次购买日期 | 最后一次交货日期 | 替代产品 | 状态 | 备注 |
---|---|---|---|---|---|---|
74AXP1G125GX | 935303211125 |
环境信息
下表中的所有产品型号已停产。参见表 停产信息 了解更多信息。
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74AXP1G125GX | 74AXP1G125GXH | 74AXP1G125GX | Always Pb-free |
文档 (8)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AXP1G125 | Low-power buffer/line driver; 3-state | Data sheet | 2021-09-30 |
axp1g125 | 74AXP1G125 IBIS model | IBIS model | 2014-10-22 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_document_leaflet_Logic_AXP_technology_portfolio_201904 | AXP – Extremely low-power logic technology portfolio | Leaflet | 2019-04-05 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
MAR_SOT1226 | MAR_SOT1226 Topmark | Top marking | 2013-06-03 |
SOT1226 | plastic, leadless thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body | Package information | 2022-05-30 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |