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    74CBTLV3257-Q100

    Quad 1-of-2 multiplexer/demultiplexer

    The 74CBTLV3257-Q100 provides a quad 1-of-2 high-speed multiplexer/demultiplexer with common select (S) and output enable (OE) inputs. The low ON resistance of the switch allows inputs to be connected to outputs without adding propagation delay or generating additional ground bounce noise. When pin OE = LOW, one of the two switches is selected (low-impedance ON-state) with pin S. When pin OE = HIGH, all switches are in the high-impedance OFF-state, independent of pin S. To ensure the high-impedance OFF-state during power-up or power-down, OE should be tied to the VCC through a pull-up resistor. The current-sinking capability of the driver determines the minimum value of the resistor.

    Schmitt trigger action at control input, makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 2.3 V to 3.6 V.

    This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

    This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

    特性

    • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

      • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

    • Supply voltage range from 2.3 V to 3.6 V

    • High noise immunity

    • Complies with JEDEC standard:

      • JESD8-5 (2.3 V to 2.7 V)

      • JESD8-B/JESD36 (2.7 V to 3.6 V)

    • 5 Ω switch connection between two ports

    • Rail to rail switching on data I/O ports

    • CMOS low power consumption

    • Latch-up performance exceeds 250 mA per JESD78B Class I level A

    • IOFF circuitry provides partial Power-down mode operation

    • ESD protection:

      • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

      • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

    • Multiple package options

    • DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints

    参数类型

    Type numberProduct statusVCC (V)RON (Ω)Logic switching levelstpd (ns)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
    74CBTLV3257BQ-Q100Production2.3 - 3.67CMOS/LVTTL0.2very low-40~1259313.762DHVQFN16
    74CBTLV3257D-Q100Production2.3 - 3.67CMOS/LVTTL0.2very low-40~125929.652SO16
    74CBTLV3257PW-Q100Production2.3 - 3.67CMOS/LVTTL0.2very low-40~1251254.554.6TSSOP16

    封装

    型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
    74CBTLV3257BQ-Q100
    DHVQFN16
    (SOT763-1)     		SOT763-1SOT763-1_115ActiveTV325774CBTLV3257BQ-Q10X
    ( 9353 022 27115 )
    74CBTLV3257D-Q100
    SO16
    (SOT109-1)     		SOT109-1SO-SOJ-REFLOW
    SO-SOJ-WAVE
    		SOT109-1_118Active74CBTLV3257D74CBTLV3257D-Q100J
    ( 9353 022 31118 )
    74CBTLV3257PW-Q100
    TSSOP16
    (SOT403-1)     		SOT403-1SSOP-TSSOP-VSO-WAVE
    		SOT403-1_118ActiveTLV325774CBTLV3257PW-Q10J
    ( 9353 022 29118 )

    环境信息

    型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
    74CBTLV3257BQ-Q10074CBTLV3257BQ-Q10X74CBTLV3257BQ-Q100Always Pb-free
    74CBTLV3257D-Q10074CBTLV3257D-Q100J74CBTLV3257D-Q100Always Pb-free
    74CBTLV3257PW-Q10074CBTLV3257PW-Q10J74CBTLV3257PW-Q100Always Pb-free
    品质及可靠性免责声明

    文档 (10)

    文件名称标题类型日期
    74CBTLV3257_Q100Quad 1-of-2 multiplexer/demultiplexerData sheet2024-02-01
    cbtlv3257IBIS model of 74CBTLV3257IBIS model2017-12-11
    Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
    SOT763-1plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm bodyPackage information2023-05-11
    SO-SOJ-WAVEFootprint for wave solderingWave soldering2009-10-08
    SO-SOJ-REFLOWFootprint for reflow solderingReflow soldering2009-10-08
    WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
    SOT109-1plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm bodyPackage information2023-11-07
    SOT403-1plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm bodyPackage information2023-11-08
    SSOP-TSSOP-VSO-WAVEFootprint for wave solderingWave soldering2009-10-08

    支持

    如果您需要设计/技术支持，请告知我们并填写 应答表, 我们会尽快回复您。

    模型

    文件名称标题类型日期
    cbtlv3257IBIS model of 74CBTLV3257IBIS model2017-12-11

    样品

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    样品订单通常需要2-4天寄送时间。

    如果您尚未取得安世半导体的直接采购帐号，我们的全球与区域经销网络可以协助您取得样品

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