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    74AUP2G0604

    Low-power inverting buffer with open-drain and inverter

    The 74AUP2G0604 is a single inverting buffer with open-drain output and a single inverter. It features two input pins (nA), an output pin (2Y) and an open-drain output pin (1Y).

    Schmitt trigger action at all inputs makes the circuit tolerant of slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.

    This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

    This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

    特性

    • Wide supply voltage range from 0.8 V to 3.6 V

    • High noise immunity

    • Complies with JEDEC standards:

      • JESD8-12 (0.8 V to 1.3 V)

      • JESD8-11 (0.9 V to 1.65 V)

      • JESD8-7 (1.2 V to 1.95 V)

      • JESD8-5 (1.8 V to 2.7 V)

      • JESD8-B (2.7 V to 3.6 V)

    • Low static power consumption; ICC = 0.9 μA (maximum)

    • Latch-up performance exceeds 100 mA per JESD 78 Class II

    • Inputs accept voltages up to 3.6 V

    • Low noise overshoot and undershoot < 10 % of VCC

    • IOFF circuitry provides partial power-down mode operation

    • ESD protection:

      • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

      • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

    • Multiple package options

    • Specified from -40 °C to +85 °C and -40 °C to +125 °C

    参数类型

    Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
    74AUP2G0604GMProduction0.8 - 3.6CMOS± 1.94.0702ultra low-40~1252906.5145XSON6
    74AUP2G0604GNProduction0.8 - 3.6CMOS± 1.94.0702ultra low-40~12527511.7171XSON6
    74AUP2G0604GSProduction0.8 - 3.6CMOS± 1.94.0702ultra low-40~12527214.8177XSON6
    74AUP2G0604GWProduction0.8 - 3.6CMOS± 1.94.0702ultra low-40~12526438.6153TSSOP6

    封装

    型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号,(订购码(12NC))
    74AUP2G0604GM
    XSON6
    (SOT886)
    SOT886REFLOW_BG-BD-1
    SOT886_125Activea674AUP2G0604GMH
    ( 9352 996 53125 )
    74AUP2G0604GN
    XSON6
    (SOT1115)
    SOT1115REFLOW_BG-BD-1
    SOT1115_125Activea674AUP2G0604GNH
    ( 9352 996 54125 )
    74AUP2G0604GS
    XSON6
    (SOT1202)
    SOT1202REFLOW_BG-BD-1
    SOT1202_125Activea674AUP2G0604GSH
    ( 9352 996 55125 )
    74AUP2G0604GW
    TSSOP6
    (SOT363-2)
    SOT363-2SOT363-2_125Activea674AUP2G0604GWH
    ( 9352 996 56125 )

    环境信息

    型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
    74AUP2G0604GM74AUP2G0604GMH74AUP2G0604GMAlways Pb-free
    74AUP2G0604GN74AUP2G0604GNH74AUP2G0604GNAlways Pb-free
    74AUP2G0604GS74AUP2G0604GSH74AUP2G0604GSAlways Pb-free
    74AUP2G0604GW74AUP2G0604GWH74AUP2G0604GWAlways Pb-free
    品质及可靠性免责声明

    文档 (15)

    文件名称标题类型日期
    74AUP2G0604Low-power inverting buffer with open-drain and inverterData sheet2023-07-24
    aup2g0604IBIS modelIBIS model2014-12-21
    Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
    Nexperia_document_Logic_CombinationLogic_infocard_201710Combination logic solutions cardLeaflet2017-10-16
    Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
    SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
    SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
    SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
    MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
    SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

    支持

    如果您需要设计/技术支持,请告知我们并填写 应答表, 我们会尽快回复您。

    模型

    文件名称标题类型日期
    aup2g0604IBIS modelIBIS model2014-12-21

    样品

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    样品订单通常需要2-4天寄送时间。

    如果您尚未取得安世半导体的直接采购帐号,我们的全球与区域经销网络可以协助您取得样品

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