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    74AUP2G0604

    Low-power inverting buffer with open-drain and inverter

    The 74AUP2G0604 is a single inverting buffer with open-drain output and a single inverter. It features two input pins (nA), an output pin (2Y) and an open-drain output pin (1Y).

    Schmitt trigger action at all inputs makes the circuit tolerant of slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.

    This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

    This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

    特性

    • Wide supply voltage range from 0.8 V to 3.6 V

    • High noise immunity

    • Complies with JEDEC standards:

      • JESD8-12 (0.8 V to 1.3 V)

      • JESD8-11 (0.9 V to 1.65 V)

      • JESD8-7 (1.2 V to 1.95 V)

      • JESD8-5 (1.8 V to 2.7 V)

      • JESD8-B (2.7 V to 3.6 V)

    • Low static power consumption; ICC = 0.9 μA (maximum)

    • Latch-up performance exceeds 100 mA per JESD 78 Class II

    • Inputs accept voltages up to 3.6 V

    • Low noise overshoot and undershoot < 10 % of VCC

    • IOFF circuitry provides partial power-down mode operation

    • ESD protection:

      • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

      • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

    • Multiple package options

    • Specified from -40 °C to +85 °C and -40 °C to +125 °C

    参数类型

    Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
    74AUP2G0604GMProduction0.8 - 3.6CMOS± 1.94.0702ultra low-40~1252906.5145XSON6
    74AUP2G0604GNProduction0.8 - 3.6CMOS± 1.94.0702ultra low-40~12527511.7171XSON6
    74AUP2G0604GSProduction0.8 - 3.6CMOS± 1.94.0702ultra low-40~12527214.8177XSON6
    74AUP2G0604GWProduction0.8 - 3.6CMOS± 1.94.0702ultra low-40~12526438.6153TSSOP6

    封装

    型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
    74AUP2G0604GM
    XSON6
    (SOT886)     		SOT886REFLOW_BG-BD-1
    		SOT886_125Activea674AUP2G0604GMH
    ( 9352 996 53125 )
    74AUP2G0604GN
    XSON6
    (SOT1115)     		SOT1115REFLOW_BG-BD-1
    		SOT1115_125Activea674AUP2G0604GNH
    ( 9352 996 54125 )
    74AUP2G0604GS
    XSON6
    (SOT1202)     		SOT1202REFLOW_BG-BD-1
    		SOT1202_125Activea674AUP2G0604GSH
    ( 9352 996 55125 )
    74AUP2G0604GW
    TSSOP6
    (SOT363-2)     		SOT363-2SOT363-2_125Activea674AUP2G0604GWH
    ( 9352 996 56125 )

    环境信息

    型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
    74AUP2G0604GM74AUP2G0604GMH74AUP2G0604GMAlways Pb-free
    74AUP2G0604GN74AUP2G0604GNH74AUP2G0604GNAlways Pb-free
    74AUP2G0604GS74AUP2G0604GSH74AUP2G0604GSAlways Pb-free
    74AUP2G0604GW74AUP2G0604GWH74AUP2G0604GWAlways Pb-free
    品质及可靠性免责声明

    文档 (15)

    文件名称标题类型日期
    74AUP2G0604Low-power inverting buffer with open-drain and inverterData sheet2023-07-24
    aup2g0604IBIS modelIBIS model2014-12-21
    Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
    Nexperia_document_Logic_CombinationLogic_infocard_201710Combination logic solutions cardLeaflet2017-10-16
    Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
    SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
    SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
    MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
    SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
    MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
    SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
    REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

    支持

    如果您需要设计/技术支持，请告知我们并填写 应答表, 我们会尽快回复您。

    模型

    文件名称标题类型日期
    aup2g0604IBIS modelIBIS model2014-12-21

    样品

    安世半导体客户可通过我们的销售机构或直接通过在线样品商店订购样品： https://extranet.nexperia.com.

    样品订单通常需要2-4天寄送时间。

    如果您尚未取得安世半导体的直接采购帐号，我们的全球与区域经销网络可以协助您取得样品

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