特性
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Automotive product qualification in accordance with AEC-Q100 (Grade 1)
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Specified from -40 °C to +85 °C and -40 °C to +125 °C
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5 V tolerant inputs for interfacing with 5 V logic
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Wide supply voltage range from 1.2 V to 3.6 V
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CMOS low power consumption
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Direct interface with TTL levels
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Complies with JEDEC standard:
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JESD8-7A (1.65 V to 1.95 V)
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JESD8-5A (2.3 V to 2.7 V)
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JESD8-C/JESD36 (2.7 V to 3.6 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
参数类型
Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|
74LVC157ABQ-Q100 | Production | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 2.5 | low | -40~125 | 94 | 14.9 | 64 | DHVQFN16 |
74LVC157AD-Q100 | Production | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 2.5 | low | -40~125 | 93 | 10.3 | 53.3 | SO16 |
74LVC157APW-Q100 | Production | 1.2 - 3.6 | CMOS/LVTTL | ± 24 | 2.5 | low | -40~125 | 126 | 4.9 | 56.4 | TSSOP16 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
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74LVC157ABQ-Q100 | DHVQFN16 (SOT763-1) | SOT763-1 | SOT763-1_115 | Active | VC157A | 74LVC157ABQ-Q100X ( 9352 992 78115 ) | |
74LVC157AD-Q100 | SO16 (SOT109-1) | SOT109-1 | SO-SOJ-REFLOW SO-SOJ-WAVE | SOT109-1_118 | Active | 74LVC157AD | 74LVC157AD-Q100J ( 9352 992 79118 ) |
74LVC157APW-Q100 | TSSOP16 (SOT403-1) | SOT403-1 | SSOP-TSSOP-VSO-WAVE | SOT403-1_118 | Active | LVC157A | 74LVC157APW-Q100J ( 9352 992 81118 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
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74LVC157ABQ-Q100 | 74LVC157ABQ-Q100X | 74LVC157ABQ-Q100 | Always Pb-free | ||
74LVC157AD-Q100 | 74LVC157AD-Q100J | 74LVC157AD-Q100 | Always Pb-free | ||
74LVC157APW-Q100 | 74LVC157APW-Q100J | 74LVC157APW-Q100 | Always Pb-free |
文档 (13)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LVC157A_Q100 | Quad 2-input multiplexer | Data sheet | 2024-02-12 |
AN263 | Power considerations when using CMOS and BiCMOS logic devices | Application note | 2023-02-07 |
AN11009 | Pin FMEA for LVC family | Application note | 2019-01-09 |
lvc157a | lvc157a IBIS model | IBIS model | 2013-04-07 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
lvc | lvc Spice model | SPICE model | 2013-05-06 |
SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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