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AXP1T34

Dual supply translating buffer

The AXP1T34 is a single bit, dual supply translating buffer. It features one input (A), an output (Y) and dual supply pins (VCCI and VCCO). Both VCCI and VCCO can be supplied at any voltage between 0.9 V and 5.5 V making the device suitable for translating between any voltage nodes specified (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V and 5.0 V). No power supply sequencing is required and output glitches during power supply transitions are prevented using patented circuitry. As a result, glitches will not appear on the outputs for supply transitions during power-up/down between 20 mV/μs and 5.5 V/s

The input is referenced to VCCI and the output is referenced to VCCO. Schmitt-trigger action at the input makes the circuit tolerant of slower input rise and fall times.

This device ensures low static and dynamic power consumption across the entire supply range and is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down. In suspend mode when either VCCI or VCCO are at GND level the output is in the high-impedance OFF-state

特性

  • Wide supply voltage range:

    • VCCI: 0.9 V to 5.5 V

    • VCCO: 0.9 V to 5.5 V

  • Low input capacitance; CI = 1.5 pF (typical)

  • Low output capacitance; CO = 3.8 pF (typical)

  • Low dynamic power consumption; CPD = 0.4 pF at VCCI = 1.2 V (typical)

  • Low dynamic power consumption; CPD = 11 pF at VCCO = 5 V (typical)

  • Low static power consumption; ICCI = 0.1 µA (25 °C maximum)

  • Low static power consumption; ICCO = 1.0 µA (25 °C maximum)

  • High noise immunity

  • Complies with JEDEC standard:

    • JESD8-12 (1.1 V to 1.3 V; A input)

    • JESD8-11 (1.4 V to 1.6 V)

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD12-6 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Latch-up performance exceeds 100 mA per JESD78D Class II

  • Inputs accept voltages up to 5.5 V

  • Low noise overshoot and undershoot < 10% of VCCO

  • IOFF circuitry provides partial power-down mode operation

  • Multiple package options

  • Specified from −40 °C to +125 °C

参数类型

Type numberProduct statusPackage name
AXP1T34GMProductionXSON6
AXP1T34GSProductionXSON6
AXP1T34GWProductionTSSOP5
AXP1T34GXProductionX2SON5

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
AXP1T34GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_115Activer3AXP1T34GMX
( 9356 916 27115 )
AXP1T34GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_125Activer3AXP1T34GSH
( 9356 916 26125 )
AXP1T34GW
TSSOP5
(SOT353-1) 		SOT353-1WAVE_BG-BD-1
SOT353-1_125Activer3AXP1T34GWH
( 9356 916 24125 )
AXP1T34GX
X2SON5
(SOT1226-3) 		SOT1226-3SOT1226-3_125Activer3AXP1T34GXH
( 9356 915 73125 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
AXP1T34GMAXP1T34GMXAXP1T34GM
AXP1T34GSAXP1T34GSHAXP1T34GS
AXP1T34GWAXP1T34GWHAXP1T34GW
AXP1T34GXAXP1T34GXHAXP1T34GX
品质及可靠性免责声明

文档 (10)

文件名称标题类型日期
AXP1T34Dual supply translating bufferData sheet2023-12-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-11-15
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT1226-3plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mmPackage information2020-08-27

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样品

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