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74HC373-Q100; 74HCT373-Q100

Octal D-type transparent latch; 3-state

The 74HC373-Q100; 74HCT373-Q100 is an octal D-type transparent latch with 3-state outputs. The device features latch enable (LE) and output enable (OE) inputs. When LE is HIGH, data at the inputs enter the latches. In this condition the latches are transparent, a latch output will change each time its corresponding D-input changes. When LE is LOW the latches store the information that was present at the inputs a set-up time preceding the HIGH-to-LOW transition of LE. A HIGH on OE causes the outputs to assume a high-impedance OFF-state. Operation of the OE input does not affect the state of the latches. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

特性

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 2.0 V to 6.0 V

  • CMOS low power dissipation

  • High noise immunity

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Complies with JEDEC standards:

    • JESD8C (2.7 V to 3.6 V)
    • JESD7A (2.0 V to 6.0 V)

  • Input levels:

    • For 74HC373-Q100: CMOS level

    • For 74HCT373-Q100: TTL level

  • 3-state non-inverting outputs for bus-oriented applications

  • Common 3-state output enable input

  • ESD protection:

    • MIL-STD-883, method 3015 exceeds 2000 V

    • HBM JESD22-A114F exceeds 2000 V

    • MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 Ω)

  • Multiple package options

  • DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints

参数类型

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74HC373BQ-Q100Production2.0 - 6.0CMOS± 7.8128low-40~125789.150DHVQFN20
74HC373D-Q100Production2.0 - 6.0CMOS± 7.8128low-40~1258527.361SO20
74HC373PW-Q100Production2.0 - 6.0CMOS± 7.8128low-40~1251004.644.7TSSOP20
74HCT373BQ-Q100Production4.5 - 5.5TTL± 6148low-40~125789.150DHVQFN20
74HCT373D-Q100Production4.5 - 5.5TTL± 6148low-40~1258527.361SO20
74HCT373PW-Q100Production4.5 - 5.5TTL± 6148low-40~1251004.644.7TSSOP20

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74HC373BQ-Q100
DHVQFN20
(SOT764-1) 		SOT764-1SOT764-1_115ActiveHC373BQ74HC373BQ-Q100,115
( 9352 990 34115 )
74HC373D-Q100
SO20
(SOT163-1) 		SOT163-1WAVE_BG-BD-1
SOT163-1_118Active74HC373D74HC373D-Q100,118
( 9352 990 35118 )
74HC373PW-Q100
TSSOP20
(SOT360-1) 		SOT360-1SSOP-TSSOP-VSO-WAVE
SOT360-1_118ActiveHC37374HC373PW-Q100,118
( 9352 990 36118 )
74HCT373BQ-Q100
DHVQFN20
(SOT764-1) 		SOT764-1SOT764-1_115ActiveHCT373BQ74HCT373BQ-Q100,11
( 9352 990 37115 )
74HCT373D-Q100
SO20
(SOT163-1) 		SOT163-1WAVE_BG-BD-1
SOT163-1_118Active74HCT373D74HCT373D-Q100,118
( 9352 990 38118 )
74HCT373PW-Q100
TSSOP20
(SOT360-1) 		SOT360-1SSOP-TSSOP-VSO-WAVE
SOT360-1_118ActiveHCT37374HCT373PW-Q100,11
( 9352 990 39118 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74HC373BQ-Q10074HC373BQ-Q100,11574HC373BQ-Q100Always Pb-free
74HC373D-Q10074HC373D-Q100,11874HC373D-Q100Always Pb-free
74HC373PW-Q10074HC373PW-Q100,11874HC373PW-Q100Always Pb-free
74HCT373BQ-Q10074HCT373BQ-Q100,1174HCT373BQ-Q100Always Pb-free
74HCT373D-Q10074HCT373D-Q100,11874HCT373D-Q100Always Pb-free
74HCT373PW-Q10074HCT373PW-Q100,1174HCT373PW-Q100Always Pb-free
品质及可靠性免责声明

文档 (9)

文件名称标题类型日期
74HC_HCT373_Q100Octal D-type transparent latch; 3-stateData sheet2020-07-22
AN11044Pin FMEA 74HC/74HCT familyApplication note2019-01-09
hcHC/HCT Spice modelSPICE model2022-02-17
HCT_USER_GUIDEHC/T User GuideUser manual1997-10-31
SOT764-1plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm bodyPackage information2022-06-21
SSOP-TSSOP-VSO-WAVEFootprint for wave solderingWave soldering2009-10-08
SOT360-1plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm bodyPackage information2022-06-21
SOT163-1plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm bodyPackage information2022-06-20
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08

支持

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模型

文件名称标题类型日期
hcHC/HCT Spice modelSPICE model2022-02-17

样品

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