特性
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Automotive product qualification in accordance with AEC-Q100 (Grade 1)
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
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Wide supply voltage range:
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VCC(A): 1.2 V to 3.6 V and VCC(B): 1.65 V to 5.5 V
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IOFF circuitry provides partial Power-down mode operation
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Inputs accept voltages up to 5.5 V
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ESD protection:
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HBM: ANSI/ESDA/Jedec JS-001 Class 2 exceeds 2500 V for A port
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HBM: ANSI/ESDA/Jedec JS-001 Class 3B exceeds 15000 V for B port
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CDM: ANSI/ESDA/Jedec JS-002 Class C3 exceeds 1500 V
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Latch-up performance exceeds 100 mA per JESD 78B Class II
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Multiple package options
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DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints
参数类型
Type number | Product status | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXB0108BQ-Q100 | Production | 1.2 - 3.6 | 1.65 - 5.5 | CMOS | ± 0.02 | 5.5 | 8 | low | -40~125 | 94 | 10.7 | 61 | DHVQFN20 |
NXB0108PW-Q100 | Production | 1.2 - 3.6 | 1.65 - 5.5 | CMOS | ± 0.02 | 5.5 | 8 | low | -40~125 | 92 | 2.3 | 35 | TSSOP20 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
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NXB0108BQ-Q100 | DHVQFN20 (SOT764-1) | SOT764-1 | SOT764-1_115 | Active | NXB0108B | NXB0108BQ-Q100X ( 9356 910 54115 ) | |
NXB0108PW-Q100 | TSSOP20 (SOT360-1) | SOT360-1 | SSOP-TSSOP-VSO-WAVE | SOT360-1_118 | Active | NXB0108 | NXB0108PW-Q100J ( 9356 910 52118 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
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NXB0108BQ-Q100 | NXB0108BQ-Q100X | NXB0108BQ-Q100 | |||
NXB0108PW-Q100 | NXB0108PW-Q100J | NXB0108PW-Q100 |
文档 (5)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
NXB0108_Q100 | Dual supply translating transceiver; auto direction sensing; 3-state | Data sheet | 2021-11-09 |
nxb0108 | NXB0108 IBIS model | IBIS model | 2020-10-30 |
SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-21 |
订购、定价与供货
样品
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