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LSF0102

2-bit bidirectional multi-voltage level translator; open-drain; push-pull

The LSF0102 is a 2 channel bidirectional multi-voltage level translator for open-drain and push-pull applications. It supports up to 100 MHz up translation and ≥100 MHz down translation at ≤ 30 pF capacitive load. There is no need for a direction pin which minimizes system effort. The LSF0102 supports 5 V tolerant I/O pins for compatibility with TTL levels in a variety of applications. The ability to set up different voltage translation levels on each channel makes the device very flexible and suitable for a lot of different applications.

特性

  • Bidirectional voltage translation with no direction pin

  • Up translation

    • ≤ 100 MHz; CL = 30 pF

    • ≤ 50 MHz; CL = 50 pF

  • Down translation

    • ≥ 100 MHz; CL = 30 pF

    • ≥ 50 MHz; CL = 50 pF

  • Hot insertion

  • Bidirectional voltage level translation between:

    • 0.95 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V

    • 1.2 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V

    • 1.8 V and 2.5 V, 3.3 V and 5.0 V

    • 2.5 V and 3.3 V and 5.0 V

    • 3.3 V and 5.0 V

  • Low standby current

  • 5 V tolerant I/O pins to support TTL

  • Low RON provides less signal distortion

  • High-impedance I/O pins for EN = Low.

  • Flow-through pinout for easy PCB trace routing.

  • Latch-up performance exceeds 100 mA per JESD78 class II level A

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Specified from -40 °C to +125 °C

目标应用

  • GPIO, MDIO, PMBus, SMBus, SDIO, UART, I2C, and other interfaces in Telecom infrastructure

  • Industrial

  • Personal computing

参数类型

Type numberProduct statusVCC(A) (V)VCC(B) (V)Logic switching levelsOutput drive capability (mA)tpd (ns)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
LSF0102DCProduction0.95 - 5.00.95 - 5.0CMOSn.a.0.72low-40~12520636.1117VSSOP8
LSF0102DPProduction0.95 - 5.00.95 - 5.0CMOSn.a.0.72low-40~12521921.1107TSSOP8
LSF0102GSProduction0.95 - 5.00.95 - 5.0CMOSn.a.0.72low-40~12528312.1152XSON8
LSF0102GXProduction0.95 - 5.00.95 - 5.0CMOSn.a.0.72low-40~1254077.9200X2SON8

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
LSF0102DC
VSSOP8
(SOT765-1) 		SOT765-1SOT765-1_125Activeh2LSF0102DCH
( 9356 902 93125 )
LSF0102DP
TSSOP8
(SOT505-2) 		SOT505-2SOT505-2_125Activeh2LSF0102DPH
( 9356 909 55125 )
LSF0102GS
XSON8
(SOT1203) 		SOT1203REFLOW_BG-BD-1
SOT1203_115Activeh2LSF0102GSX
( 9356 911 15115 )
LSF0102GX
X2SON8
(SOT1233-2) 		SOT1233-2SOT1233-2_115Activeh2LSF0102GXX
( 9356 902 94115 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
LSF0102DCLSF0102DCHLSF0102DC
LSF0102DPLSF0102DPHLSF0102DP
LSF0102GSLSF0102GSXLSF0102GS
LSF0102GXLSF0102GXXLSF0102GX
品质及可靠性免责声明

文档 (9)

文件名称标题类型日期
LSF01022-bit bidirectional multi-voltage level translator; open-drain; push-pullData sheet2023-11-28
AN90050Pin FMEA for LSF familyApplication note2023-12-14
lsf0102LSF0102 IBIS modelIBIS model2020-04-14
SOT1233-2plastic thermal enhanced extremely thin small outline package; no leads;8 terminals; body 1.35 x 0.8 x 0.32 mmPackage information2022-04-21
SOT505-2plastic, thin shrink small outline package; 8 leads; 0.65 mm pitch; 3 mm x 3 mm x 1.1 mm bodyPackage information2022-06-03
MAR_SOT1203MAR_SOT1203 TopmarkTop marking2013-06-03
SOT1203plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm bodyPackage information2022-06-03
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
SOT765-1plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm bodyPackage information2022-06-03

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模型

文件名称标题类型日期
lsf0102LSF0102 IBIS modelIBIS model2020-04-14

订购、定价与供货

样品

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