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LSF0101

1-bit bidirectional multi-voltage level translator; open-drain; push-pull

The LSF0101 is an 1 channel bidirectional multi-voltage level translator for open-drain and push-pull applications. It supports up to 100 MHz up translation and ≥ 100 MHz down translation at ≤ 30 pF capacitive load. There is no need for a direction pin which minimizes system effort. The LSF0101 supports 5 V tolerant I/O pins for compatibility with TTL levels in a variety of applications. The ability to set up different voltage translation levels on each channel makes the device very flexible and suitable for a lot of different applications.

特性

  • Bidirectional voltage translation with no direction pin

  • Up translation

    • ≤ 100 MHz; CL = 30 pF

    • ≤ 50 MHz; CL = 50 pF

  • Down translation

    • ≥ 100 MHz; CL = 30 pF

    • ≥ 50 MHz; CL = 50 pF

  • Hot insertion

  • Bidirectional voltage level translation between:

    • 0.95 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V

    • 1.2 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V

    • 1.8 V and 2.5 V, 3.3 V and 5.0 V

    • 2.5 V and 3.3 V and 5.0 V

    • 3.3 V and 5.0 V

  • Low standby current

  • 5 V tolerant I/O pins to support TTL

  • Low RON provides less signal distortion

  • High-impedance I/O pins for EN = Low.

  • Flow-through pinout for easy PCB trace routing.

  • Latch-up performance exceeds 100 mA per JESD78 class II level A

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +125 °C

目标应用

  • GPIO, MDIO, PMBus, SMBus, SDIO, UART, I2C, and other interfaces in Telecom infrastructure

  • Industrial

  • Personal computing

参数类型

Type numberProduct statusVCC(A) (V)VCC(B) (V)Logic switching levelsOutput drive capability (mA)tpd (ns)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
LSF0101GMProduction0.95 - 5.00.95 - 5.0CMOSn.a.0.71low-40~1253027.2153XSON6
LSF0101GWProduction0.95 - 5.00.95 - 5.0CMOSn.a.0.71low-40~12527346.6161TSSOP6
LSF0101GXProduction0.95 - 5.00.95 - 5.0CMOSn.a.0.71low-40~12552122.4278X2SON6

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
LSF0101GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_115Activeh1LSF0101GMX
( 9356 909 56115 )
LSF0101GW
TSSOP6
(SOT363-2) 		SOT363-2SOT363-2_125Activeh1LSF0101GWH
( 9356 902 95125 )
LSF0101GX
X2SON6
(SOT1255-2) 		SOT1255-2SOT1255-2_147Activeh1LSF0101GXZ
( 9356 902 96147 )

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
LSF0101GMLSF0101GMXLSF0101GM
LSF0101GWLSF0101GWHLSF0101GW
LSF0101GXLSF0101GXZLSF0101GX
品质及可靠性免责声明

文档 (9)

文件名称标题类型日期
LSF01011-bit bidirectional multi-voltage level translator; open-drain; push-pullData sheet2023-11-27
LSF0101_Q1001-bit bidirectional multi-voltage level translator; open-drain; push-pullData sheet2023-11-27
AN90050Pin FMEA for LSF familyApplication note2023-12-14
lsf0101LSF0101 IBIS modelIBIS model2020-04-14
SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
SOT1255-2plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mmPackage information2020-08-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

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模型

文件名称标题类型日期
lsf0101LSF0101 IBIS modelIBIS model2020-04-14

订购、定价与供货

样品

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