特性
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Wide supply voltage range:
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VCC(A): 0.9 V to 5.5 V
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VCC(B): 0.9 V to 5.5 V
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Low input capacitance; CI = 1.5 pF (typical)
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Low output capacitance; CO = 3.8 pF (typical)
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Low dynamic power consumption; CPD = 10 pF (typical)
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Low static power consumption; ICC = 2 μA (25 °C maximum)
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High noise immunity
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Complies with JEDEC standard:
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JESD8-12 (1.1 V to 1.3 V; inputs)
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JESD8-11 (1.4 V to 1.6 V)
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JESD8-7 (1.65 V to 1.95 V)
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JESD8-5 (2.3 V to 2.7 V)
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JESD8C (2.7 V to 3.6 V)
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JESD12-6 (4.5 V to 5.5 V)
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ESD protection:
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HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
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CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
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Latch-up performance exceeds 100 mA per JESD78D Class II
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Inputs accept voltages up to 5.5 V
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Low noise overshoot and undershoot < 10% of VCCO
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IOFF circuitry provides partial power-down mode operation
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Specified from -40 °C to +125 °C
参数类型
Type number | Product status | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
74AXP8T245BQ | Production | 0.9 - 5.5 | 0.9 - 5.5 | CMOS | ± 12 | 9 | 4 | ultra low | -40~125 | 68 | 6.4 | 42 | DHVQFN24 |
74AXP8T245PW | Production | 0.9 - 5.5 | 0.9 - 5.5 | CMOS | ± 12 | 9 | 4 | ultra low | -40~125 | 81 | 2.3 | 37 | TSSOP24 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
74AXP8T245BQ | DHVQFN24 (SOT815-1) | SOT815-1 | SOT815-1_118 | Active | AXP8T245 | 74AXP8T245BQJ ( 9356 908 13118 ) | |
74AXP8T245PW | TSSOP24 (SOT355-1) | SOT355-1 | SSOP-TSSOP-VSO-WAVE | SOT355-1_118 | Active | 4AXP8T245 | 74AXP8T245PWJ ( 9356 908 12118 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
74AXP8T245BQ | 74AXP8T245BQJ | 74AXP8T245BQ | week 25, 2019 | ||
74AXP8T245PW | 74AXP8T245PWJ | 74AXP8T245PW | week 25, 2019 |
文档 (7)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AXP8T245 | 8-bit dual supply translating transceiver; 3-state | Data sheet | 2020-02-11 |
AN90029 | Pin FMEA for AXPnT family | Application note | 2021-07-13 |
axp8t245 | 74AXP8T245 IBIS model | IBIS model | 2020-11-20 |
Nexperia_document_leaflet_Logic_AXP_technology_portfolio_201904 | AXP – Extremely low-power logic technology portfolio | Leaflet | 2019-04-05 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SOT355-1 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-22 |
SOT815-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 24 terminals; 0.5 mm pitch; 5.5 mm x 3.5 mm x 1 mm body | Package information | 2021-08-17 |
订购、定价与供货
样品
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