特性
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Bidirectional voltage translation with no direction pin
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Up translation
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≤ 100 MHz; CL = 30 pF
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≤ 40 MHz; CL = 50 pF
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Down translation
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≥ 100 MHz; CL = 30 pF
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≤ 40 MHz; CL = 50 pF
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Hot insertion
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Bidirectional voltage level translation between:
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0.95 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V
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1.2 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V
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1.8 V and 2.5 V, 3.3 V and 5.0 V
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2.5 V and 3.3 V and 5.0 V
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3.3 V and 5.0 V
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Low standby current
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5 V tolerant I/O pins to support TTL
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Low RON provides less signal distortion
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High-impedance I/O pins for EN = Low.
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Flow-through pinout for easy PCB trace routing.
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Latch-up performance exceeds 100 mA per JESD78 class II level A
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ESD protection:
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HBM ANSI/ESDA/JEDEC JS-001 exceeds 2000 V
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CDM ANSI/ESDA/JEDEC JS-002 exceeds 1000 V
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Specified from -40 °C to +125 °C
目标应用
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GPIO, MDIO, PMBus, SMBus, SDIO, UART, I2C, and other interfaces in Telecom infrastructure
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Industrial
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Personal computing
参数类型
Type number | Product status | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
LSF0108BQ | Production | 0.95 - 5.0 | 0.95 - 5.0 | CMOS | n.a. | 1.4 | 8 | low | -40~125 | 77 | 8.7 | 49 | DHVQFN20 |
LSF0108PW | Production | 0.95 - 5.0 | 0.95 - 5.0 | CMOS | n.a. | 1.4 | 8 | low | -40~125 | 100 | 4.5 | 45 | TSSOP20 |
封装
型号 | 封装 | 尺寸版本 | 回流焊/波峰焊 | 包装 | 状态 | 标示 | 可订购的器件编号,(订购码(12NC)) |
---|---|---|---|---|---|---|---|
LSF0108BQ | DHVQFN20 (SOT764-1) | SOT764-1 | SOT764-1_115 | Active | LSF0108 | LSF0108BQX ( 9356 902 88115 ) | |
LSF0108PW | TSSOP20 (SOT360-1) | SOT360-1 | SSOP-TSSOP-VSO-WAVE | SOT360-1_118 | Active | LSF0108 | LSF0108PWJ ( 9356 902 89118 ) |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 | 无铅转换日期 |
---|---|---|---|---|---|
LSF0108BQ | LSF0108BQX | LSF0108BQ | week 25, 2019 | ||
LSF0108PW | LSF0108PWJ | LSF0108PW | week 25, 2019 |
文档 (7)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
LSF0108 | 8-bit bidirectional multi-voltage level translator; open-drain; push-pull | Data sheet | 2023-11-28 |
AN90050 | Pin FMEA for LSF family | Application note | 2023-12-14 |
lsf0108 | LSF0108 IBIS model | IBIS model | 2020-04-14 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Package information | 2022-06-21 |
样品
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