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PESDxUSB3S

ESD protection for differential data lines

The devices are ElectroStatic Discharge (ESD) protection devices for one, two or three differential channels.

The PESDxUSB3S is footprint compatible to PCMFxUSB3S.

The devices provide protection to downstream components from ESD voltages up to ±15 kV on each signal line.

Type number

Number of channels

Package Name

PESD1USB3S

1

WLCSP5

PESD2USB3S

2

WLCSP10

PESD3USB3S

3

WLCSP15

特性

  • Allows replacement between PCMFxUSB3S common-mode filters with ESD protection and PESDxUSB3S ESD protection in the same footprint
  • TrEOS protection process for very high system-level ESD robustness: superior protection of sensitive SoCs
  • ESD protection for one, two and three differential channels up to ±15kV contact discharge according to IEC 61000-4-2
  • Industry-standard WLCSP5, 10 and 15 packages for smallest footprint

目标应用

  • Smartphones, cellular and cordless phones
  • USB3.1, USB2.0, HDMI2.0, HDMI1.4
  • General-purpose downstream ESD protection
  • Tablet PC and mobiles Internet Device (MID)
  • MIPI D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI)

参数类型

Type numberPackage versionPackage nameSize (mm)ConfigurationNr of linesVRWM (V)Cd [typ] (pF)IPPM [max] (A)VESD (kV)Product status
PESD1USB3SWLCSP5_2-1-2WLCSP50.77 x 1.17 x 0.57Unidirectional250.45815Production
PESD2USB3SWLCSP10_4-2-4WLCSP101.57 x 1.17 x 0.57Unidirectional4-0.45815Production
PESD3USB3SWLCSP15_6-3-6WLCSP152.37 x 1.17 x 0.57Unidirectional650.45815Production

(-) dash denotes: "Parameter value not specified for this product"

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号,(订购码(12NC))
PESD1USB3S
WLCSP5
(WLCSP5_2-1-2)
WLCSP5_2-1-2WLCSP5_2-1-2_087ActiveStandard MarkingPESD1USB3SZ
( 9340 696 83087 )
PESD1USB3S/C
WLCSP5
(WLCSP5_2-1-2)
WLCSP5_2-1-2WLCSP5_2-1-2_087ActiveStandard MarkingPESD1USB3S/CZ
( 9346 602 89087 )
PESD2USB3S
WLCSP10
(WLCSP10_4-2-4)
WLCSP10_4-2-4WLCSP10_4-2-4_087ActiveStandard MarkingPESD2USB3SZ
( 9340 696 84087 )
PESD2USB3S/C
WLCSP10
(WLCSP10_4-2-4)
WLCSP10_4-2-4WLCSP10_4-2-4_087ActiveStandard MarkingPESD2USB3S/CZ
( 9346 602 91087 )
PESD3USB3S
WLCSP15
(WLCSP15_6-3-6)
WLCSP15_6-3-6WLCSP15_6-3-6_087ActiveStandard MarkingPESD3USB3SZ
( 9340 696 85087 )
PESD3USB3S/C
WLCSP15
(WLCSP15_6-3-6)
WLCSP15_6-3-6WLCSP15_6-3-6_087ActiveStandard MarkingPESD3USB3S/CZ
( 9346 602 92087 )

下表中的版本已停产。参见表 停产信息 了解更多信息。

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号,(订购码(12NC))
PESD1USB3S/C
WLCSP5
(WLCSP5_2-1-2)
WLCSP5_2-1-2WLCSP5_2-1-2_115Withdrawn / End-of-lifeStandard MarkingPESD1USB3S/CX
( 9346 602 89115 )
PESD2USB3S/C
WLCSP10
(WLCSP10_4-2-4)
WLCSP10_4-2-4WLCSP10_4-2-4_115Withdrawn / End-of-lifeStandard MarkingPESD2USB3S/CX
( 9346 602 91115 )
PESD3USB3S/C
WLCSP15
(WLCSP15_6-3-6)
WLCSP15_6-3-6WLCSP15_6-3-6_115Withdrawn / End-of-lifeStandard MarkingPESD3USB3S/CX
( 9346 602 92115 )

停产信息

型号可订购的器件编号,(订购码(12NC))最后一次购买日期最后一次交货日期替代产品状态备注
PESD1USB3S934069683115
PESD1USB3S/C934660289115
PESD2USB3S934069684115
PESD2USB3S/C934660291115
PESD3USB3S934069685115
PESD3USB3S/C934660292115

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
PESD1USB3SPESD1USB3SZ暂无信息
You can request this via a support request
Always Pb-free
PESD1USB3S/CPESD1USB3S/CZ暂无信息
You can request this via a support request
PESD2USB3SPESD2USB3SZ暂无信息
You can request this via a support request
Always Pb-free
PESD2USB3S/CPESD2USB3S/CZ暂无信息
You can request this via a support request
PESD3USB3SPESD3USB3SZ暂无信息
You can request this via a support request
Always Pb-free
PESD3USB3S/CPESD3USB3S/CZ暂无信息
You can request this via a support request

下表中的版本已停产。参见表 停产信息 了解更多信息。

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
PESD1USB3S/CPESD1USB3S/CX暂无信息
You can request this via a support request
week 25, 2019
PESD2USB3S/CPESD2USB3S/CX暂无信息
You can request this via a support request
week 25, 2019
PESD3USB3S/CPESD3USB3S/CX暂无信息
You can request this via a support request
week 25, 2019
品质及可靠性免责声明

文档 (4)

文件名称标题类型日期
PESDXUSB3S_SERESD protection for differential data linesData sheet2019-01-30
WLCSP5_2-1-2wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm bodyPackage information2020-04-21
WLCSP15_6-3-6wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm bodyPackage information2020-04-21
WLCSP10_4-2-4wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm bodyPackage information2020-04-21

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