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74LVC1G58



Low-power configurable multiple function gate




The 74LVC1G58 is a configurable multiple function gate with Schmitt-trigger inputs. The device can be configured as any of the following logic functions AND, OR, NAND, NOR, XOR, inverter and buffer; using the 3-bit input. All inputs can be connected diectly to VCC or GND. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.


This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.














特性


    

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    Wide supply voltage range from 1.65 V to 5.5 V
    

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    High noise immunity
    

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    ±24 mA output drive (VCC = 3.0 V)
    

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    CMOS low power dissipation
    

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    IOFF circuitry provides partial Power-down mode operation
    

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    Latch-up performance exceeds 250 mA
    

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    Direct interface with TTL levels
    

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    Overvoltage tolerant inputs to 5.5 V
    

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    Complies with JEDEC standard:
    

      

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      JESD8-7 (1.65 V to 1.95 V)
      

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      JESD8-5 (2.3 V to 2.7 V)
      

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      JESD8C (2.7 V to 3.6 V)
      

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      JESD36 (4.5 V to 5.5 V)
      

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    ESD protection:
    

      

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      HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
      

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      CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
      

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    Multiple package options
    

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    Specified from -40 °C to +85 °C and -40 °C to +125 °C.
    

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参数类型
Type numberProduct statusVCC(A) (V)VCC(B) (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74LVC1G58GMProductionn.a.n.a.TTL± 326.31501low-40~1253087.5155XSON6
74LVC1G58GNProductionn.a.n.a.TTL± 326.31501low-40~12532521.0201XSON6
74LVC1G58GSProductionn.a.n.a.TTL± 326.31501low-40~12531326.6209XSON6
74LVC1G58GVProductionn.a.n.a.TTL± 326.31501low-40~12525054.7163TSOP6
74LVC1G58GWProductionn.a.n.a.TTL± 326.31501low-40~12527750.1165TSSOP6
封装
型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74LVC1G58GM
XSON6

(SOT886)
SOT886REFLOW_BG-BD-1
SOT886_132ActiveYK74LVC1G58GM,132
(
9352 772 12132
)

SOT886_115ActiveYK74LVC1G58GM,115
(
9352 772 12115
)

74LVC1G58GN
XSON6

(SOT1115)
SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveYK74LVC1G58GN,132
(
9352 917 89132
)

74LVC1G58GS
XSON6

(SOT1202)
SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveYK74LVC1G58GS,132
(
9352 929 17132
)

74LVC1G58GV
TSOP6

(SOT457)
SOT457REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT457_125ActiveV5874LVC1G58GV,125
(
9352 760 74125
)

74LVC1G58GW
TSSOP6

(SOT363-2)
SOT363-2SOT363-2_125ActiveYK74LVC1G58GW,125
(
9352 760 75125
)

环境信息
型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74LVC1G58GM74LVC1G58GM,13274LVC1G58GMAlways Pb-free
74LVC1G58GM74LVC1G58GM,11574LVC1G58GMAlways Pb-free
74LVC1G58GN74LVC1G58GN,13274LVC1G58GNAlways Pb-free
74LVC1G58GS74LVC1G58GS,13274LVC1G58GSAlways Pb-free
74LVC1G58GV74LVC1G58GV,12574LVC1G58GVAlways Pb-free
74LVC1G58GW74LVC1G58GW,12574LVC1G58GWAlways Pb-free
品质及可靠性免责声明
文档 (20)
文件名称标题类型日期
74LVC1G58Low-power configurable multiple function gateData sheet2023-08-18
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11009Pin FMEA for LVC familyApplication note2019-01-09
lvc1g5874LVC1G58 IBIS modelIBIS model2014-10-20
Nexperia_document_leaflet_Logic_SingleConfigurableLogic_201812Single configurable logicLeaflet2019-01-04
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT457MAR_SOT457 TopmarkTop marking2013-06-03
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT457plastic, surface-mounted package (SC-74; TSOP6); 6 leadsPackage information2023-03-03
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
支持
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模型
文件名称标题类型日期
lvc1g5874LVC1G58 IBIS modelIBIS model2014-10-20
样品
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