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74AUP1G97

Low-power configurable multiple function gate

The 74AUP1G97 is a configurable multiple function gate with Schmitt-trigger inputs. The device can be configured as any of the following logic functions MUX, AND, OR, NAND, NOR, inverter and buffer; using the 3-bit input. All inputs can be connected directly to VCC or GND. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

特性

  • Wide supply voltage range from 0.8 V to 3.6 V

  • CMOS low power dissipation

  • High noise immunity

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

Type numberProduct statusVCC(A) (V)VCC(B) (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)Nr of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP1G97GMProductionn.a.n.a.CMOS± 1.98.7701ultra low-40~1252906.5145XSON6
74AUP1G97GNProductionn.a.n.a.CMOS± 1.98.7701ultra low-40~12527511.7171XSON6
74AUP1G97GSProductionn.a.n.a.CMOS± 1.98.7701ultra low-40~12527214.8177XSON6
74AUP1G97GWProductionn.a.n.a.CMOS± 1.98.7701ultra low-40~12526438.6153TSSOP6
74AUP1G97GXProductionn.a.n.a.CMOS± 1.98.7701ultra low-40~125---X2SON6

封装

型号封装尺寸版本回流焊/波峰焊包装状态标示可订购的器件编号，（订购码(12NC)）
74AUP1G97GM
XSON6
(SOT886) 		SOT886REFLOW_BG-BD-1
SOT886_132ActiveaV74AUP1G97GM,132
( 9352 799 63132 )
SOT886_115ActiveaV74AUP1G97GM,115
( 9352 799 63115 )
74AUP1G97GN
XSON6
(SOT1115) 		SOT1115REFLOW_BG-BD-1
SOT1115_132ActiveaV74AUP1G97GN,132
( 9352 917 48132 )
74AUP1G97GS
XSON6
(SOT1202) 		SOT1202REFLOW_BG-BD-1
SOT1202_132ActiveaV74AUP1G97GS,132
( 9352 928 73132 )
74AUP1G97GW
TSSOP6
(SOT363-2) 		SOT363-2SOT363-2_125ActiveaV74AUP1G97GW,125
( 9352 799 62125 )
74AUP1G97GX
X2SON6
(SOT1255-2) 		SOT1255-2SOT1255-2_147ActiveaV74AUP1G97GXZ
( 9353 071 23147 )

停产信息

型号可订购的器件编号，（订购码(12NC)）最后一次购买日期最后一次交货日期替代产品状态备注
74AUP1G97GX935307123125

环境信息

型号可订购的器件编号化学成分RoHSRHF指示符无铅转换日期
74AUP1G97GM74AUP1G97GM,13274AUP1G97GMAlways Pb-free
74AUP1G97GM74AUP1G97GM,11574AUP1G97GMAlways Pb-free
74AUP1G97GN74AUP1G97GN,13274AUP1G97GNAlways Pb-free
74AUP1G97GS74AUP1G97GS,13274AUP1G97GSAlways Pb-free
74AUP1G97GW74AUP1G97GW,12574AUP1G97GWAlways Pb-free
74AUP1G97GX74AUP1G97GXZ74AUP1G97GXAlways Pb-free
品质及可靠性免责声明

文档 (18)

文件名称标题类型日期
74AUP1G97Low-power configurable multiple function gateData sheet2023-07-24
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup1g97aup1g97 IBIS modelIBIS model2015-09-06
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_document_leaflet_Logic_SingleConfigurableLogic_201812Single configurable logicLeaflet2019-01-04
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2023Nexperia Selection Guide 2023Selection guide2023-05-10
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2022-06-01
SOT363-2plastic thin shrink small outline package; 6 leads; body width 1.25 mmPackage information2022-11-21
SOT1255-2plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mmPackage information2020-08-27
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2022-05-27
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2022-06-01
REFLOW_BG-BD-1Reflow soldering profileReflow soldering2021-04-06

支持

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模型

文件名称标题类型日期
aup1g97aup1g97 IBIS modelIBIS model2015-09-06

样品

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